Senior Package Layout Engineer - Hardware

Job Title

Senior Package Layout Engineer - Hardware

Role Summary

Senior engineer on the package/layout team responsible for detailed IC substrate and package layout for NVIDIA GPUs and SoCs. Collaborates with technical package leads, ASIC and PCB teams to deliver high-density, high-speed package designs that meet cost, manufacturability, and electrical requirements.

This role focuses on substrate breakout, pinout optimization, routing, power distribution, and tooling/methodology development for production-ready packages.

Experience Level

Senior - typically requires 5+ years of relevant industry experience in PCB/substrate/layout for graphics cards, motherboards, line cards, or similar high-density designs.

Responsibilities

Core responsibilities include layout implementation, collaboration across disciplines, and improving layout methodologies.

• Implement high-speed, high-density ASIC package layouts as part of a layout team.
• Create substrate breakout patterns and optimize package pinouts for system-level trade-offs.
• Perform package placement, routing, stack-up, reference plane and power-distribution planning using Cadence APD/SiP tool suite.
• Evaluate design feasibility for size, cost, and system performance; propose trade-offs to technical leads.
• Develop CAD libraries, symbols, and databases for layout tools.
• Plan schedules and work with design teams to resolve manufacturing, cost, and electrical issues.
• Develop and document methodologies to improve layout productivity and quality.

Requirements

Must-have skills and experience followed by useful but optional qualifications.

• 5+ years experience in PCB layout for graphics cards, motherboards, line cards, or related products.
• Significant experience with Cadence APD or SiP and/or PCB layout tools, including Constraint Manager.
• Strong understanding of high-speed design and signal integrity practices.
• Experience performing package routing, placement, stack-up, and power distribution.
• Ability to conduct feasibility studies and propose implementable design trade-offs.
• Nice-to-have: experience with HDI designs, substrate layout for wire bond and flip-chip packages, Virtuoso, Calibre, and Valor.

Education Requirements

Hold a B.S. in Electrical Engineering or equivalent practical experience (the posting allows equivalent experience in lieu of a degree).

About the Company

Company: NVIDIA

Headquarters: Santa Clara, California, USA

NVIDIA is a global leader in accelerated computing, renowned for its innovative solutions in AI and digital twins that transform diverse industries. The company specializes in networking technologies, providing end-to-end InfiniBand and Ethernet solutions for servers and storage that optimize performance and scalability. NVIDIA serves sectors such as high-performance computing, enterprise data centers, and cloud computing, constantly reinventing its products and services to stay ahead in the market.