Senior Package Layout Engineer
Responsible for definition, design, and verification of advanced 2.5D/3D package layouts for Arm SoCs across IoT, Automotive, and Compute products. Works within the System-in-Package team and collaborates with IP, PCB, SI/PI, Systems teams and external technology partners.
Salary range: $161,500β$218,500 per year.
Senior β typically requires 4+ years of relevant experience, especially with Cadence APD & Allegro toolsets.
The role focuses on package layout implementation, verification, and cross-functional collaboration.
Must-have and preferred technical skills and experiences.
Degree in Electrical Engineering or equivalent practical experience (posting states "An Electrical Engineering degree or equivalent").
Company: Arm
Headquarters: Cambridge, United Kingdom
ARM is a global leader in semiconductor and software design, driving innovation in computing technology. The company specializes in designing processors and systems that provide the essential building blocks for electronic devices. ARM's architecture is widely used in smartphones, servers, and IoT devices, and its collaborative culture fosters bold thinking, diversity, and high-impact benefits for its talented workforce.
