Senior Member of Technical Staff, Thin Films Engineer

Job Title

Senior Member of Technical Staff, Thin Films Engineer

Role Summary

Senior technical leader responsible for developing, optimizing, and transferring thin film deposition processes (CVD, ALD, PVD, epitaxy, thermal/plasma, furnace, implant, anneal/treatment) from development into high-volume manufacturing for advanced technology nodes.

Works within Manufacturing Development Customer Engineering (MDCE) to solve manufacturing challenges, improve yield and throughput, and meet foundry customer requirements across multiple nodes.

Experience Level

Senior - requires 5+ years of semiconductor industry experience with a strong focus on thin film deposition processes (minimum qualifications specify 5+ years).

Responsibilities

Lead process and technical initiatives to enable manufacturability, yield, and throughput improvements across advanced technology nodes.

• Champion safety, quality, yield, throughput, and cost optimization across thin film deposition modules.
• Drive defectivity reduction and uniformity improvements through systematic process development.
• Lead technical problem resolution and deliver solutions that meet aggressive node targets.
• Optimize equipment performance in partnership with internal teams and suppliers.
• Translate complex technical data into strategic actions and align solutions with customer and business requirements.
• Own end-to-end resolution of manufacturing challenges spanning multiple engineering disciplines.
• Collaborate with Technology Development, High-Volume Manufacturing, Integration, Device, Yield, Quality, Reliability teams, and suppliers.
• Present technical findings to engineering audiences and executive leadership; foster in-person collaboration to accelerate decision-making.
• Monitor industry trends, contribute to technology roadmaps, and drive initiatives that maintain manufacturing competitiveness.

Requirements

Minimum technical skills and experience required for initial consideration; preferred skills indicate stronger candidacy.

• Must-have: 5+ years semiconductor industry experience with a strong focus on thin film deposition process development and manufacturing engineering.
• Must-have: Proven technical leadership and experience resolving complex manufacturing issues across multiple nodes.
• Must-have: Experience working with equipment suppliers (e.g., Applied Materials, Lam, ASM, TEL) on process optimization.
• Must-have: Fab startup experience across manufacturing, quality, R&D, and supply chain functions.
• Must-have: Experience with Statistical Process Control (SPC), Design of Experiments (DOE), and factory automation systems.
• Must-have: Strong analytical skills focused on yield improvement, variation reduction, and equipment optimization.
• Nice-to-have: Experience with Gate-All-Around (GAA) logic technologies and foundry business models.
• Nice-to-have: Cross-functional leadership experience and a record of delivering customized solutions between Technology Development and HVM organizations.

Education Requirements

Minimum: Masters degree in Electrical, Mechanical, Chemical Engineering, Materials Science, or a related STEM field. Preferred: Ph.D. in a related engineering or materials discipline with research publications or patents in thin film technologies.

About the Company

Company: Intel Corporation

Headquarters: Santa Clara, California, USA

Intel Corporation is a leading multinational technology company known for its innovative semiconductor solutions, including microprocessors, artificial intelligence accelerators, and memory products. Headquartered in the United States, Intel focuses on cutting-edge technology and a collaborative working environment, driving advancements in semiconductor manufacturing to meet global demands. The company emphasizes professional development and aims to shape the future of technology through groundbreaking designs.