Senior Member of Technical Staff (SMTS) — Process Development, CMP, NAND

Job Title

Senior Member of Technical Staff (SMTS) — Process Development, CMP, NAND

Role Summary

Serve as the module-level CMP technical authority on the Advanced NAND Process Development team. Define CMP technical direction, lead FOAK developments, and drive cross-functional execution to deliver manufacturable CMP processes that meet program and yield goals.

Collaborate with process integration and adjacent process areas (Wet Etch, CVD, Diffusion, Metals, Lithography, Dry Etch) and with equipment suppliers to develop, qualify, and transfer advanced CMP processes on 300 mm platforms.

Experience Level

Senior. Extensive industry experience required; see Education Requirements for degree-linked experience expectations.

Responsibilities

Lead technical CMP development and execution across NAND nodes and coordinate cross-functional activities to achieve program objectives.

• Own and lead NAND CMP process modules; translate technology challenges into executable roadmaps across current and future nodes.
• Drive cross-functional execution with Technology Development, Process Integration, Manufacturing, and Equipment teams.
• Lead FOAK CMP process development, including recipe architecture, control strategies, and integration alignment.
• Ensure process robustness and manufacturability via run-to-run controls, SPC, qualification execution, and risk mitigation.
• Resolve complex yield, defectivity, and integration issues using model-based and data-driven problem solving.
• Define and execute process-level hardware strategies in collaboration with equipment suppliers.
• Mentor engineers, build SME pipelines, publish internal findings/Best Known Methods, and present status to senior stakeholders.
• Integrate AI-assisted tools where appropriate to improve efficiency and effectiveness; contribute to continuous improvement efforts.

Requirements

Must-have technical and interpersonal skills. Degree and years-of-experience expectations are listed in Education Requirements below.

• Proven experience in CMP process development and hands-on execution for advanced NAND technologies.
• Deep expertise in CMP chemistry, physics, and integration; strong understanding of pad–slurry–wafer interactions and pattern density/layout effects.
• Experience with multiple CMP process types (metal, dielectric, barrier/hardmask, poly‑Si/Si CMP).
• Extensive hands-on experience with advanced 300 mm CMP OEM platforms and driving hardware capability, throughput, and cost improvements.
• Proficiency in statistical process control (SPC), data analysis, and qualification methodologies.
• Ability to independently drive complex technical execution, resolve yield and defectivity issues, and influence cross-functional teams.
• Record of technical contributions (publications and/or patents).
• Technical leadership, strong influencing skills, clear structured technical communication, and data-driven decision making.

Education Requirements

PhD with ≥12 years of relevant experience, or Master’s with ≥15 years of relevant experience in Electrical Engineering, Materials Science, Chemical Engineering, Physics, or a related technical field. Publications/patents and a strong record of technical contributions are expected. No specific certifications were listed.

About the Company

Company: Micron Technology

Headquarters: Boise, Idaho, USA

Micron Technology is a global leader in memory and storage solutions, dedicated to transforming how the world uses information. The company offers a diverse portfolio of high-performance DRAM, NAND, and NOR memory products under the Micron and Crucial brands. With a commitment to customer focus and technological innovation, Micron drives advancements in artificial intelligence, 5G, and other data-centric applications, empowering users to learn, communicate, and progress.