Senior Member of Technical Staff — Process Development, Dry Etch (NAND)

Job Title

Senior Member of Technical Staff — Process Development, Dry Etch (NAND)

Role Summary

The Senior Member of Technical Staff leads development and transfer of advanced dry etch processes for NAND technologies. The role owns key process modules, defines FOAK development and robustness/control strategies, and coordinates cross-functional execution across technology development, process integration, and manufacturing.

Provides technical leadership and mentorship to engineers and drives solutions for scaling, yield, and integration challenges.

Experience Level

Senior-level; requires extensive, long-tenured experience in dry etch process development. See Education Requirements for degree-specific experience guidance.

Responsibilities

Accountable for end-to-end dry etch process development, integration, and manufacturability.

• Own and roadmap dry etch process levels/modules across multiple nodes (N / N+1 / N+2).
• Lead FOAK development: recipe architecture, EPD strategy, control plans, and integration alignment.
• Design and implement tool robustness mechanisms (controls, monitors, redundancy) to improve manufacturability and maturity.
• Drive cross-functional execution with Technology Development, Process Integration, and Manufacturing; report technical status and risks.
• Collaborate with equipment and supplier teams to define hardware roadmaps and resolve yield, defectivity, and integration issues using data- and model-based methods.
• Mentor MTS, interns, and early-career engineers on plasma etch fundamentals and data-driven problem solving.
• Contribute to patents and technical knowledge-sharing forums.
• Apply AI-assisted tools where appropriate to enhance process robustness, monitoring, and efficiency.

Requirements

Must-have technical and leadership capabilities for senior dry etch process development roles.

• Must-have: Advanced dry etch process development experience, including FOAK execution and mechanistic understanding of plasma etch physics and chemistry.
• Must-have: Strong DOE, SPC and control-strategy competency.
• Must-have: Proven ability to lead cross-functional teams, mentor engineers, and communicate with executives.
• Must-have: Experience resolving complex yield, defectivity, and integration issues using data- and model-driven approaches.
• Nice-to-have: Record of patents, publications, invited talks, or leadership in technical committees/consortia (evidence of external recognition).
• Nice-to-have: Experience applying AI-enabled analysis or automation to process monitoring and robustness.

Education Requirements

PhD with 3 years of relevant experience, or Masters with 5 years of relevant experience, in Electrical Engineering, Materials Science, Chemical Engineering, Physics, or a related technical field in dry etch; equivalent practical experience considered.

About the Company

Company: Micron Technology

Headquarters: Boise, Idaho, USA

Micron Technology is a global leader in memory and storage solutions, dedicated to transforming how the world uses information. The company offers a diverse portfolio of high-performance DRAM, NAND, and NOR memory products under the Micron and Crucial brands. With a commitment to customer focus and technological innovation, Micron drives advancements in artificial intelligence, 5G, and other data-centric applications, empowering users to learn, communicate, and progress.