Senior Member of Technical Staff, NAND Advanced Thin Films Process Development

Job Title

Senior Member of Technical Staff, NAND Advanced Thin Films Process Development

Role Summary

Technical authority for 3D NAND advanced thin-film development. Sets technical direction, leads multi-functional projects, and drives adoption of process and hardware innovations to improve device performance and manufacturing yield.

Experience Level

Senior level - requires extensive experience (15–20 years) in thin film R&D for NAND processing.

Responsibilities

Primary responsibilities include strategy, technical leadership, cross-functional execution, and mentoring.

• Define technical strategy and lead multi-functional projects in structural and electrical film development.
• Architect solutions and promote innovative technologies across engineering teams.
• Influence technical standards and drive process improvements to recover and expand process windows without yield trade-offs.
• Lead advanced process development, fault-fixing, integration, and wafer-level electrical validation across modules.
• Drive root-cause analysis, FMEA, SPC, and corrective actions for complex process/hardware/device interactions.
• Use advanced characterization to correlate process parameters to device performance and derive predictive models for reliability and scaling.
• Lead multi-functional teams and vendor engagements to advance hardware/process capability and secure resources.
• Mentor engineers through training, case studies, and hands-on development; build subject-matter-expert pipelines.
• Document and present technical findings: internal papers, best-known methods, and presentations to senior leadership.

Requirements

Must-have technical skills, proven leadership, and domain experience specific to NAND thin-film processing.

• 15–20 years of hands-on experience in thin-film research and development for NAND processes, with emphasis on plasma and thermal CVD for dielectric (high-K and low-K) and carbon-based depositions.
• Advanced proficiency with thin-film deposition methods (PECVD, Thermal CVD, ALD) and equipment optimization.
• Experience optimizing hardware: precursor delivery, temperature control, chamber matching/segregation, and trade-offs between batch and single-wafer processing.
• Strong understanding of process–mechanical–device interactions, reliability modeling, and 3D NAND scaling challenges.
• Skilled in advanced characterization techniques (SIMS, XPS, TEM, EDX/EELS, electrical stress testing, TDS) and deriving correlations to device behavior.
• Demonstrated leadership in multi-functional development, vendor collaboration, and mentoring engineers to raise technical capability.

Education Requirements

PhD or equivalent in Materials Science, Chemical Engineering, Physics, Chemistry, Electrical Engineering, or a related technical field (the posting explicitly allows equivalent practical experience).

About the Company

Company: Micron Technology

Headquarters: Boise, Idaho, USA

Micron Technology is a global leader in memory and storage solutions, dedicated to transforming how the world uses information. The company offers a diverse portfolio of high-performance DRAM, NAND, and NOR memory products under the Micron and Crucial brands. With a commitment to customer focus and technological innovation, Micron drives advancements in artificial intelligence, 5G, and other data-centric applications, empowering users to learn, communicate, and progress.