Senior Manager, Semiconductor IC Packaging & Assembly Engineering

Job Title

Senior Manager, Semiconductor IC Packaging & Assembly Engineering

Role Summary

Lead assembly sustaining engineering and high-volume manufacturing (HVM) execution for advanced semiconductor packaging technologies, with emphasis on power packaging and wide-bandgap technologies (SiC, GaN). The role drives yield, process stability, quality control, change management, and manufacturing readiness across internal teams and external OSAT partners.

Serve as the manufacturing engineering interface for package development, translating design and qualification requirements into scalable, cost-competitive production execution.

Experience Level

Senior — typically requires 10+ years in semiconductor manufacturing and packaging engineering, with 3+ years leading technical projects or small engineering teams.

Responsibilities

Primary responsibilities focus on sustaining engineering, yield and quality improvement, process change control, NPI-to-HVM transfers, and vendor management.

• Support sustaining engineering across IC package assembly technologies and product lines to maintain and improve production performance.
• Drive HVM improvement activities targeting yield, cycle time, throughput, cost, and process stability.
• Establish and maintain process control, defect reduction, SPC/DOE practices, and manufacturing KPIs/dashboards.
• Investigate process, reliability, and customer quality issues using structured root-cause analysis and statistical methods.
• Manage process changes for materials, equipment, tooling, flows, and site transfers; execute qualification plans.
• Lead NPI-to-production transfers and manufacturability reviews; ensure readiness for high-volume ramps.
• Coordinate and manage global OSAT and contract manufacturing partners, including performance tracking, audits, and qualification.
• Provide technical guidance, mentoring, and day-to-day support to assembly engineering team members.

Requirements

Must-have technical skills and experience for successful performance in this role.

• 10+ years of semiconductor manufacturing and packaging engineering experience with strong exposure to IC assembly operations, package development, and NPI-to-HVM transfers.
• 3+ years leading technical projects, mentoring engineers, or managing small engineering teams in a semiconductor manufacturing environment.
• Hands-on expertise in assembly processes: wirebond, flip chip, wafer-level packaging, multi-chip modules, molding, singulation, SMT, and advanced packaging techniques.
• Experience with power packaging and power devices (Smart Power Stages, Vertical Power Stages, Power Modules, Discrete FET packages) and familiarity with DBC, AMB, and advanced interconnects.
• Strong capability in yield analysis, SPC, DOE, statistical analysis tools, process control, qualification methods, and reliability assessment.
• Proven experience working with global OSAT partners and outsourced manufacturing ecosystems, including selection, qualification, and technical management of subcontractors.
• Practical knowledge of semiconductor quality systems, change management, and structured ramp execution.
• Excellent analytical, organizational, communication, and cross-functional collaboration skills.

Preferred technical experience (not mandatory):

• Experience with 2.5D/3D packaging, SiP, fan-out, embedded die, heterogeneous integration, wafer-level packaging, and advanced substrate/interconnect technologies.
• Familiarity with automotive, AI/datacenter infrastructure power, and high-performance computing product requirements.
• Experience with geographically distributed engineering teams and global manufacturing operations.
• Knowledge of reliability and industry standards such as JEDEC and IPC.

Education Requirements

Bachelor's degree in Electrical Engineering, Materials Science, Mechanical Engineering, Chemical Engineering, or a related technical discipline is required. A Master's degree or PhD in engineering or a related field is preferred.

About the Company

Company: Renesas

Headquarters: Hitachinaka, Japan

Renesas is a global leader in embedded semiconductor solutions, providing high-quality products across automotive, industrial, infrastructure, and IoT sectors. With over 22,000 employees in more than 30 countries, the company focuses on scalable solutions that enhance user experience and drive innovation while committed to sustainability and energy efficiency.