Senior Manager, Semi Packaging Engineering

Job Title

Senior Manager, Semi Packaging Engineering

Role Summary

Lead Analog Devices' semiconductor module packaging strategy, technology roadmap, and execution for MEMS and RF modules. Manage a team of packaging and module-integration engineers and partner with cross-functional stakeholders to deliver reliable, scalable, and cost-effective packaging solutions from concept through high-volume manufacturing.

Experience Level

Senior-level role. Requires substantial industry experience (15+ years in semiconductor packaging and assembly engineering) and leadership experience (3+ years managing technical staff).

Responsibilities

Accountable for technical leadership, team development, and delivery of module packaging solutions.

• Define and drive MEMS and RF module packaging technology roadmap aligned to product and business goals.
• Lead, coach, and develop a team of packaging and module integration engineers; set goals and establish operating mechanisms.
• Provide technical and program leadership for package architecture and integration from concept through design, process development, qualification, and release-to-manufacturing.
• Partner with product, procurement, operations, and other stakeholders to define requirements and make trade-offs for performance, cost, schedule, and risk.
• Establish and govern OSAT/vendor engagement models for NPI and high-volume manufacturing, including capability assessment, process readiness, yield and quality improvement, and change control.
• Drive reliability strategy and qualification standards; oversee failure analysis, corrective actions, and continuous improvement.
• Lead cost, quality, and cycle-time improvements through design-to-cost and material/process optimization; support supplier negotiations.
• Represent packaging at technical and business reviews; communicate status, risks, and mitigation plans to stakeholders and executives.
• Willingness to travel approximately 10% for supplier and stakeholder engagements.

Requirements

Must-have qualifications and competencies.

• 15+ years of experience in semiconductor packaging and assembly engineering, with a track record of delivering programs from concept to production.
• 3+ years of people leadership experience (hiring, performance management, coaching, and developing technical talent).
• Demonstrated ability to lead cross-functional programs, manage multiple priorities, and meet schedule, cost, and quality objectives.
• Strong technical breadth across package architectures, materials, assembly processes, reliability/qualification, and failure analysis.
• Experience working with OSATs and external suppliers, including capability assessments and supplier governance.
• Working knowledge of structured problem-solving and quality tools (e.g., FMEA, DOE, SPC, 8D) and change management processes (e.g., PCN/ECN).
• Excellent written and verbal communication skills with the ability to influence stakeholders at all levels.

Nice-to-have:

• Familiarity with MEMS and/or RF module integration requirements.

Education Requirements

Master's degree or PhD in Mechanical Engineering, Electrical Engineering, or Materials Science.

About the Company

Company: Analog Devices

Headquarters: Norwood, Massachusetts, USA

Analog Devices is a leading global semiconductor company that bridges the physical and digital worlds, enabling breakthroughs at the Intelligent Edge. With a focus on innovation, ADI develops solutions that drive advancements in digitized factories, mobility, and digital healthcare. The company employs around 24,000 people globally and reported revenues exceeding $9 billion in FY24, creating technologies that transform lives across various sectors.