Senior Manager, Package Process Integration
QorvoJob Title
Senior Manager, Package Process Integration
Role Summary
Lead the integrated circuit (IC) packaging technology roadmap and execution for product lines, driving short- and long-term R&D projects and ensuring manufacturing readiness across internal and external sites.
Manage technical teams, develop packaging and assembly capabilities (materials, design rules, equipment), and coordinate with assembly, packaging technology, and high-volume manufacturing groups to deliver cost-, size-, and performance-optimized module solutions.
Experience Level
Senior / Management level. Requires approximately 12 years of relevant technical experience with at least 10 years of management experience in packaging and assembly of semiconductors.
Responsibilities
Key responsibilities include driving technology direction, R&D execution, and cross-functional deployment of packaging solutions.
- Own and drive IC packaging technology roadmap and 3+ year skunkworks R&D initiatives.
- Lead execution of R&D projects and transition technologies into high-volume manufacturing (HVM).
- Hire, develop, and manage technical personnel in packaging and assembly disciplines.
- Ensure manufacturing sites (internal and external) are prepared with required materials, design rules, packaging approaches, and equipment capabilities.
- Maintain and improve packaging design rules to optimize performance, cost of ownership, and size.
- Implement systems for ideation, qualification, and deployment to support smooth New Product Introduction (NPI).
- Coordinate across Assembly Processes, IC Packaging Technologies, and HVM to address product needs and cost-quality targets.
- Occasional domestic travel and international travel 2–3 times per year to meet customers and partners.
Requirements
Must-have technical background and demonstrated leadership in semiconductor packaging, assembly, and manufacturing.
- Must-have: ~12 years of experience in assembly processes, IC packaging technologies, and high-volume manufacturing.
- Must-have: ~10 years of management experience in packaging and assembly of semiconductors, including System-in-Package (SiP) work.
- Must-have: Practical experience with multiple package types (experience covering at least four of: DSMBGA, DSMLGA, LGA, MCM, WLCSP, Leadframe).
- Must-have: Hands-on familiarity with assembly processes: SMT, die attach, wire bond, molding, marking, shielding.
- Must-have: Strong experience in high-volume semiconductor assembly manufacturing and process improvement methodologies (Six Sigma, Lean).
- Nice-to-have: Experience leading design-rule improvement programs, materials and equipment capability development, and formal NPI deployment systems.
Education Requirements
Bachelor's degree in Electrical Engineering, Mechanical Engineering, Semiconductors, Materials, Electronic Engineering, or a related field is required (as stated). The role also specifies extensive industry experience (12 years) and management experience (10 years).
About the Company
Company: Qorvo
Headquarters: Greensboro, NC, US
Qorvo supplies innovative semiconductor solutions that enhance connectivity and power for a variety of applications, including consumer electronics, automotive, and healthcare. With a focus on RF and power solutions, Qorvo combines technology leadership and global manufacturing to address complex challenges in fast-growing industries. Their commitment to excellence and innovation drives them to shape the future of wireless communications.
