Senior HSIO/DDR Bench Test Engineer

Job Title

Senior HSIO/DDR Bench Test Engineer

Role Summary

Member of the Post-Silicon Engineering / Hardware Engineering group responsible for developing and executing test methodologies and characterization for high-speed interfaces and DDR subsystems on advanced SoCs. The role focuses on silicon bring-up, electrical compliance validation, lab-based characterization, and resolving field/customer issues.

Work involves cross-functional collaboration with IC design, systems engineering, customer engineering, and hardware applications to qualify designs, debug board/package issues, and analyze parametric performance across conditions.

Experience Level

Senior — typically 5+ years of relevant hardware/bench test engineering experience (posting lists experience ranges by degree from 1–5+ years; this is a senior-level role).

Responsibilities

Primary responsibilities center on planning and executing bench test and characterization activities for high-speed interfaces and DDR subsystems, debugging first-silicon issues, and supporting customers.

• Define and execute test methodologies and characterization plans for high-speed SERDES interfaces (PCIe, USB3, UFS, DP, MIPI) and DDR subsystems (LP-DDR, PC-DDR).
• Perform first-silicon bring-up, electrical compliance validation, and root-cause debug of transmitter/receiver, PHY, controller, clocking and IO-related issues.
• Collect and analyze parametric performance data across operating conditions and configurations; produce technical reports and documentation.
• Assist hardware design and debug for power integrity (PI) and signal integrity (SI) problems related to package and board design.
• Develop and maintain bench test automation and characterization scripts; integrate lab equipment into test flows.
• Work with cross-functional teams and customer support to resolve RMAs and time-critical field issues.
• Conduct specialized analyses (feasibility studies, signal-integrity analysis, teardown analyses) as needed.

Requirements

Key technical and professional requirements. Education requirements are summarized separately below.

• Must-have: Hands-on hardware engineering or bench test experience with silicon bring-up, device characterization, and debug of high-speed interfaces and DDR subsystems.
• Must-have: Practical experience with lab instruments such as oscilloscopes, TDR/VNA, J-BERT, and test equipment for SERDES/DDR characterization.
• Must-have: Strong problem-solving and debugging skills; ability to work independently and take initiative.
• Must-have: Strong verbal and written communication, documentation and teamwork skills; ability to coordinate with remote and local teams.
• Must-have: Familiarity with signal integrity (eye diagrams, differential signals, jitter analysis) and power/distribution issues.
• Nice-to-have: Experience with SERDES transmitter/receiver design blocks and validation, DDR2/3/4/5 and LPDDR protocols and timing, board design review practices.
• Nice-to-have: Experience with test automation using Python or C# and ASIC device-level characterization; system-level knowledge is a plus.
• Nice-to-have: Familiarity with mixed-signal CMOS, PLLs, delay circuits, and clocking architectures.
• English fluency (verbal and written) required.

Education Requirements

Posting requires a technical degree or equivalent academic credential: Bachelor's degree in Computer Science, Electrical/Electronics Engineering, or related field (with experience), OR Master's degree in a related field, OR PhD in a related field. The posting also allows for equivalent practical experience in lieu of a formal degree and lists varying experience thresholds depending on degree level.

About the Company

Company: Qualcomm

Headquarters: San Diego, California, United States

Qualcomm is a global leader in semiconductor and telecommunications equipment, specializing in mobile technologies and innovations. Known for its Adreno GPUs, the company provides solutions enabling advancements in mobile gaming, AI, VR/AR, and autonomous driving. Qualcomm's cutting-edge technology and commitment to high-performance, power-efficient designs drive the evolution of mobile graphics and connectivity worldwide.