Senior HBM Electrical Failure Analysis (EFA) Engineer

Job Title

Senior HBM Electrical Failure Analysis (EFA) Engineer

Role Summary

Member of the Global Quality DRAM/Emerging Memory Quality and Reliability Assurance (DEMQRA) team responsible for electrical characterization and electrical failure analysis (EFA) of High Bandwidth Memory (HBM) products. The role distinguishes package vs. device failures, records and categorizes failure mechanisms, and communicates findings to product, package, and reliability engineering teams.

Uses test and analysis equipment to perform detailed characterization, maintains FA data, and drives improvements to EFA processes to reduce test time, increase throughput, and improve failure assignment accuracy.

Experience Level

Senior — typically requires 5+ years of experience in the semiconductor field.

Responsibilities

Primary responsibilities include electrical failure analysis, equipment support, technical training, engineering requests, data management, and quality/reliability reviews.

• Analyze failed components from reliability and functional testing: interpret test results, adjust test parameters to isolate sensitivities, perform visual inspections, and document/categorize electrical failures.
• Coordinate escalated analysis with Product Yield Enhancement (PYE), Product Engineering, Package Reliability, and physical failure analysis teams.
• Troubleshoot, configure, maintain, and upgrade test hardware and software; identify and coordinate repairs; develop and deploy FA software.
• Provide technical support and training to lab users, conduct on‑the‑job training, assist with equipment setup, and interpret data for root‑cause suggestions.
• Execute engineering requests and experiments, summarize results, and create repair converters as needed.
• Create and maintain failure analysis databases, track FA data, identify false failures, and analyze/summarize trends.
• Participate in reviews related to test time reduction, datasheet/qualification modifications, Material Review Board (MRB), and Process of Record Review Board (PORRB), and review customer reports/data.

Requirements

Key skills and experience required or preferred for the role.

• Must-have: 5+ years experience in the semiconductor industry; knowledge of DRAM operation, fabrication processes, and device physics.
• Must-have: Experience with failure analysis, troubleshooting/debugging, advanced packaging concepts, wafer/component/module testing flows, and strong analytical skills.
• Must-have: Strong troubleshooting, organizational skills, attention to detail, and effective written and oral communication.
• Must-have: Ability to work independently or in team environments and basic understanding of electrical test equipment.
• Must-have: Ability to use analytical tools on test equipment (examples: uMate, curve tracer, oscilloscope) and familiarity with test platforms and probers.
• Nice-to-have: Familiarity with Unix, DFII/Cadence, and test platforms such as uMate, Merlin, Mongoose SM3.

Education Requirements

Required: Bachelor’s degree in Electrical, Electronics, or Computer Engineering. Desired: Master’s degree in Electrical, Electronics, or Computer Engineering.

About the Company

Company: Micron Technology

Headquarters: Boise, Idaho, USA

Micron Technology is a global leader in memory and storage solutions, dedicated to transforming how the world uses information. The company offers a diverse portfolio of high-performance DRAM, NAND, and NOR memory products under the Micron and Crucial brands. With a commitment to customer focus and technological innovation, Micron drives advancements in artificial intelligence, 5G, and other data-centric applications, empowering users to learn, communicate, and progress.