Senior Engineer, Semi Packaging Engineering

Job Title

Senior Engineer, Semi Packaging Engineering

Role Summary

Drive the design, development, and qualification of advanced semiconductor packaging solutions (wire-bond, flip-chip, system-in-package, and module-based products) to meet performance, reliability, manufacturability, and cost targets. Collaborate with packaging engineering, product, quality, reliability, OSAT partners, and substrate suppliers to deliver production-ready packages across multiple market segments.

Work contributes to products used in automation, mobility, healthcare, energy, and data center applications.

Experience Level

Senior-level. The posting requests at least 2+ years of hands-on semiconductor packaging development or manufacturing experience.

Responsibilities

Primary responsibilities include:

• Drive and support design, development, and qualification of semiconductor packaging solutions (wire-bond, flip-chip, SiP, module products).
• Perform electrical and electromagnetic simulations of IC packages, modules, or systems using commercial simulation tools.
• Work with cross-functional teams to define product and packaging requirements and resolve complex technical issues.
• Collaborate with OSAT partners and substrate suppliers to resolve technical issues, develop processes, and improve yield.
• Establish reliability criteria with quality and reliability teams and support qualification testing.
• Develop and maintain package design guidelines, process specifications, and technical documentation.

Requirements

Must-have technical skills and conditions:

• Minimum 2+ years hands-on experience in semiconductor packaging development or manufacturing.
• Good understanding of IC packaging materials and their mechanical, thermal, and electrical behavior.
• Strong knowledge of IC package structures, substrate technologies, and semiconductor assembly processes.
• Hands-on experience with electrical/EM simulation tools (EMPro, ADS, Sigrity, HFSS, or similar) and familiarity with RLC extraction, signal integrity, and power integrity analyses.
• Effective communication skills and ability to work in cross-functional, global teams.
• Willingness to travel approximately 10% of the time.
• Position is located on-site in Wilmington, MA.
• Note: Applicants who are not U.S. citizens or permanent residents may require export licensing review prior to hire.

Nice-to-have:

• Experience with Cadence Allegro.

Education Requirements

PhD or Master’s degree in Electrical Engineering, Mechanical Engineering, Materials Science, or a related technical field (Master’s or PhD preferred as listed in the posting).

About the Company

Company: Analog Devices

Headquarters: Norwood, Massachusetts, USA

Analog Devices is a leading global semiconductor company that bridges the physical and digital worlds, enabling breakthroughs at the Intelligent Edge. With a focus on innovation, ADI develops solutions that drive advancements in digitized factories, mobility, and digital healthcare. The company employs around 24,000 people globally and reported revenues exceeding $9 billion in FY24, creating technologies that transform lives across various sectors.