Senior Engineer, Semi Packaging Engineering

Job Title

Senior Engineer, Semi Packaging Engineering

Role Summary

Develop advanced IC packaging solutions through design, material selection, simulation, qualification, and transfer to manufacturing. Work with cross-functional teams, quality and reliability groups, and external suppliers to productize semiconductor packages.

Work includes mechanical stress and thermal simulation, substrate layout, prototype assembly and qualification, and documentation of manufacturing process flows and control plans.

Experience Level

Senior. Role expects prior packaging engineering experience (see Requirements and Education Requirements for specific experience and degree expectations).

Responsibilities

Execute projects from concept through release and communicate technical decisions to global teams and suppliers.

• Lead IC package design, material selection, and manufacturability optimization.
• Perform component- and system-level mechanical stress and thermal simulations; conduct substrate layout/simulation.
• Assemble prototypes, manage qualification testing, and perform failure analysis.
• Document manufacturing process flows, control plans, and supplier qualification requirements.
• Define reliability criteria and qualification plans with quality and reliability teams.
• Apply DOE, SPC, FMEA, and other process-improvement techniques to manufacturing and assembly issues.
• Present complex engineering analyses and results clearly to multidisciplinary and global stakeholders.

Requirements

Must-have technical skills and relevant experience; demonstrated expertise expected in several areas.

• Minimum 2 years' experience as a Packaging Engineer or in a related role productizing semiconductor devices.
• Demonstrated expertise with 3D CAD (SolidWorks) and FEA tools (ANSYS).
• Demonstrated expertise in semiconductor IC or electronics assembly, IC package design, optimization, and manufacturing.
• Experience with package reliability, failure analysis techniques, and assembly process issue resolution.
• Experience developing manufacturing control plans, process FMEA, PCN, SPC, and DOE.
• Proficiency with CAD tools such as AutoCAD.
• No travel required. First shift / days.

Education Requirements

Master's degree in Mechanical Engineering, Materials Science, Electrical Engineering, Autonomy and Robotics Engineering, or a related field is required; foreign education equivalents accepted.

About the Company

Company: Analog Devices

Headquarters: Norwood, Massachusetts, USA

Analog Devices is a leading global semiconductor company that bridges the physical and digital worlds, enabling breakthroughs at the Intelligent Edge. With a focus on innovation, ADI develops solutions that drive advancements in digitized factories, mobility, and digital healthcare. The company employs around 24,000 people globally and reported revenues exceeding $9 billion in FY24, creating technologies that transform lives across various sectors.