Senior Engineer, Semi Packaging Engineering
Analog DevicesJob Title
Senior Engineer, Semi Packaging Engineering
Role Summary
Develop and qualify advanced semiconductor packaging solutions (wire-bond, flip-chip, SiP, module-based) to meet product performance, reliability, manufacturability, and cost targets. Work with design, quality, reliability, and manufacturing partners including OSATs and substrate suppliers to resolve technical issues and improve yield.
Position requires cross-functional collaboration and approximately 10% travel.
Experience Level
Senior level. The posting specifies 2+ years of hands-on semiconductor packaging development or manufacturing experience; title indicates a senior role.
Responsibilities
The role focuses on package design, simulation, qualification, and supplier/OSAT collaboration. Key responsibilities include:
- Drive design, development, and qualification of semiconductor packaging solutions (wire-bond, flip-chip, system-in-package, module products).
- Perform electrical and electromagnetic simulations of IC packages, modules, or systems using commercial tools.
- Collaborate with cross-functional teams to capture product and packaging requirements and resolve technical issues.
- Work with OSAT partners and substrate suppliers to drive process development, optimize manufacturing, and improve yield.
- Coordinate with quality and reliability teams to establish reliability criteria and support product qualification.
- Develop and maintain package design guidelines, process specifications, and technical documentation.
Requirements
Must-have technical skills, experience, and attributes:
- At least 2 years hands-on experience in semiconductor packaging development or manufacturing.
- Strong understanding of IC packaging materials and their mechanical, thermal, and electrical behavior.
- Knowledge of IC package structures, substrate technologies, and semiconductor assembly processes.
- Hands-on experience with electrical/EM simulation tools such as EMPro, ADS, Sigrity, HFSS, or similar.
- Familiarity with RLC extraction, signal integrity, power integrity, electromagnetic simulation, and circuit simulation.
- Strong communication skills and ability to work effectively in cross-functional and global teams.
- Willingness to travel ~10% as required; first shift / day schedule.
Nice-to-have:
- Experience with Cadence Allegro.
Education Requirements
PhD or Master’s degree in Electrical Engineering, Mechanical Engineering, or Materials Science.
About the Company
Company: Analog Devices
Headquarters: Norwood, Massachusetts, USA
Analog Devices is a leading global semiconductor company that bridges the physical and digital worlds, enabling breakthroughs at the Intelligent Edge. With a focus on innovation, ADI develops solutions that drive advancements in digitized factories, mobility, and digital healthcare. The company employs around 24,000 people globally and reported revenues exceeding $9 billion in FY24, creating technologies that transform lives across various sectors.
