Senior Engineer, Semi Packaging Engineering

Job Title

Senior Engineer, Semi Packaging Engineering

Role Summary

Responsible for driving semiconductor package development and deployment within the New Product Introduction (NPI) pipeline. The role partners with business units, global operations, and external subcontractors to deliver robust, production-ready packaging solutions and improve NPI systems.

This position sits at the intersection of engineering, operations, and supply chain to ensure scalable package designs, qualification, and production readiness.

Experience Level

Senior — 3-4 years of experience in a microelectronics or semiconductor packaging environment.

Responsibilities

Primary responsibilities include package development, cross-functional coordination, and systems/process improvement.

• Lead NPI package design, qualification, and production readiness to meet performance, cost, and schedule targets.
• Collaborate with design, reliability, QA, and operations teams to ensure seamless product introduction.
• Coordinate with global subcontractor partners (notably in Asia) to execute development and production plans.
• Support supply chain resiliency efforts, cost optimization, and dual-sourcing strategies; identify and mitigate packaging-related risks.
• Contribute to NPI systems architecture, release/change-management practices, and data integrity improvements.
• Use data-driven approaches and analytics (e.g., KNIME) to reduce development cycle time and improve decisions.

Requirements

Must-have technical experience and skills; preferred items listed separately.

• 3-4 years' experience in microelectronics or semiconductor packaging development and production.
• Strong understanding of semiconductor assembly processes and package qualification methodologies.
• Experience working in fast-paced, cross-functional, global development environments and demonstrated ability to drive projects from concept to production.
• Proficiency with 2D AutoCAD; familiarity with 3D CAD is a plus.
• Willingness to travel as required (approximately 10%).

Education Requirements

Master's degree in Mechanical Engineering, Materials Science, Chemical Engineering, Applied Physics, or a related field (required).

Preferred Qualifications

Nice-to-have skills that support faster ramp and broader impact.

• Experience with systems integration or NPI systems development.
• Familiarity with assembly master data structures and change-management processes.
• Experience with data analytics tools such as KNIME or relational database systems.
• Experience working with OSATs / subcontractor ecosystems, particularly in Asia.
• Experience with simulation tools (Flotherm, ANSYS) and strong MS Office skills.

Key Skills & Attributes

• Strong problem-solving and analytical skills.
• Self-starter who operates effectively in fast-paced environments.
• Excellent communication and stakeholder management.
• Results-oriented with focus on execution and continuous improvement.

About the Company

Company: Analog Devices

Headquarters: Norwood, Massachusetts, USA

Analog Devices is a leading global semiconductor company that bridges the physical and digital worlds, enabling breakthroughs at the Intelligent Edge. With a focus on innovation, ADI develops solutions that drive advancements in digitized factories, mobility, and digital healthcare. The company employs around 24,000 people globally and reported revenues exceeding $9 billion in FY24, creating technologies that transform lives across various sectors.