Senior Engineer, Product Engineering (Media Health Reliability), Heterogeneous Integration - High Bandwidth Memory

Job Title

Senior Engineer, Product Engineering (Media Health Reliability), Heterogeneous Integration - High Bandwidth Memory

Role Summary

Lead the High Bandwidth Memory (HBM) Product Engineering Media Health team to develop and execute intrinsic and extrinsic reliability tests for DRAM, interface die, and stacked HBM products. Drive DPM reduction, intrinsic reliability margin improvements, and optimized manufacturing test flows to meet quality, cost and cycle-time KPIs.

The role requires cross-functional collaboration with Fab, Technology Development, Design, System Development, and Global Quality teams to characterize reliability issues, identify root causes, and implement process improvements and conversions.

Experience Level

Senior. The posting specifies a requirement of 3 years of semiconductor industry experience; the title and leadership responsibilities indicate a senior-level role.

Responsibilities

Primary responsibilities include test development, qualification, defect resolution, and leadership for reliability engineering of HBM products.

• Define and develop reliability stress tests, test flows, and qualification plans covering intrinsic and extrinsic product reliability.
• Manage qualification plan execution with Global Quality and resolve gating issues to support product release.
• Drive extrinsic DPM (Time-0 and field) reduction and improve intrinsic reliability via optimized manufacturing test strategies.
• Lead root-cause investigations for qualification and RMA failures using electrical and physical failure analysis and coordinate corrective actions.
• Recommend and support frontend process conversions and high-volume manufacturing changes to improve yield, cost, and reliability.
• Assess and manage technical and program risks related to DPM and process conversions; make prioritization decisions.
• Promote technical improvements and automation to gain competitive advantage and increase productivity.
• Mentor and develop engineering team members and grow project-management capability within the team.
• Make final technical decisions on risk analysis, project prioritization, and reliability trade-offs.
• Collaborate across Fab, Technology Development, Design, System, and Quality teams to deliver reliable products.
• Embed AI/automation into reliability workflows to improve analysis and execution efficiency.

Requirements

Must-have technical and leadership qualifications for successful performance in this role.

• Proven leadership and people-management experience with ability to lead technical teams and programs.
• Strong problem-solving skills with root-cause analysis and in-depth circuit-level understanding.
• Experience with statistics, data analysis tools, and scripting for data-driven reliability work.
• Track record of cross-functional collaboration to resolve complex engineering and business problems.
• Excellent written and verbal communication and presentation skills.
• Willingness to work onsite in Singapore and travel internationally (US, Taiwan, Japan) as required.
• Self-motivated, adaptable, and accountable in a dynamic manufacturing environment.

Nice-to-have:

• Prior product engineering experience in DRAM/HBM or related semiconductor products.

Education Requirements

Bachelor's or Master's degree in Electrical and Electronics Engineering is specified, with 3 years of semiconductor industry experience stated in the posting.

About the Company

Company: Micron Technology

Headquarters: Boise, Idaho, USA

Micron Technology is a global leader in memory and storage solutions, dedicated to transforming how the world uses information. The company offers a diverse portfolio of high-performance DRAM, NAND, and NOR memory products under the Micron and Crucial brands. With a commitment to customer focus and technological innovation, Micron drives advancements in artificial intelligence, 5G, and other data-centric applications, empowering users to learn, communicate, and progress.