Senior Engineer, Process Integration — Advanced Packaging TD
Responsible for process development and integration schemes for HBM memory packaging within Micron’s Advanced Packaging Technology Development (APTD) group in Taichung. Work with process module, data science, defect, and probe testing teams to develop unit processes that meet product specifications and device requirements.
Focus areas include yield and quality improvement, real-time defect analysis, inline WIP control, and developing automation to improve reporting and issue resolution.
Senior-level. The job title indicates a senior role; no specific years-of-experience were specified.
Primary responsibilities include process integration, yield and quality management, and cross-functional coordination.
Must-have technical knowledge, process skills, and software familiarity.
Nice-to-have: prior experience creating automation/AI agents for yield reporting and issue resolution.
Not specified.
Company: Micron Technology
Headquarters: Boise, Idaho, USA
Micron Technology is a global leader in memory and storage solutions, dedicated to transforming how the world uses information. The company offers a diverse portfolio of high-performance DRAM, NAND, and NOR memory products under the Micron and Crucial brands. With a commitment to customer focus and technological innovation, Micron drives advancements in artificial intelligence, 5G, and other data-centric applications, empowering users to learn, communicate, and progress.
