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Senior Engineer, Process Integration — Advanced Packaging TD

Micron Technology
July 01, 2026
Full-time
On-site
Taichung, TW
Process Engineering Jobs, Level - Senior

Job Title

Senior Engineer, Process Integration — Advanced Packaging TD

Role Summary

Responsible for process development and integration schemes for HBM memory packaging within Micron’s Advanced Packaging Technology Development (APTD) group in Taichung. Work with process module, data science, defect, and probe testing teams to develop unit processes that meet product specifications and device requirements.

Focus areas include yield and quality improvement, real-time defect analysis, inline WIP control, and developing automation to improve reporting and issue resolution.

Experience Level

Senior-level. The job title indicates a senior role; no specific years-of-experience were specified.

Responsibilities

Primary responsibilities include process integration, yield and quality management, and cross-functional coordination.

  • Lead integration processes for advanced packaging (HBM) from concept phase to high-volume production.
  • Drive yield and quality improvements to meet product milestone deliverables.
  • Perform real-time yield and defect analysis; manage inline WIP control and escalate potential issues.
  • Collaborate closely with defect, probe testing, data science, and process module teams.
  • Manage multiple projects independently to meet timelines and goals.
  • Establish and analyze DOE and apply model-based problem solving.
  • Develop automation, including AI agents, to improve routine yield reporting and issue resolution efficiency.

Requirements

Must-have technical knowledge, process skills, and software familiarity.

  • Comprehensive understanding of HBM package structure and process flow.
  • Familiarity with integrated failure modes and process change business processes.
  • Experience with DOE establishment and analysis, and model-based problem solving.
  • Proven capability in project management to meet schedule and deliverables.
  • Experience performing yield and defect analysis and implementing inline WIP controls.
  • Software experience: JMP, XMoba, Yield Cube3, Klayout, SPC.

Nice-to-have: prior experience creating automation/AI agents for yield reporting and issue resolution.

Education Requirements

Not specified.


About the Company

Company: Micron Technology

Headquarters: Boise, Idaho, USA

Micron Technology is a global leader in memory and storage solutions, dedicated to transforming how the world uses information. The company offers a diverse portfolio of high-performance DRAM, NAND, and NOR memory products under the Micron and Crucial brands. With a commitment to customer focus and technological innovation, Micron drives advancements in artificial intelligence, 5G, and other data-centric applications, empowering users to learn, communicate, and progress.

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Date Posted: 2026-06-30