Senior Engineer, Process Development, CMP

Job Title

Senior Engineer, Process Development, CMP

Role Summary

Senior CMP process development engineer on the Advanced Node NAND Process Development team in Singapore. The role focuses on developing and optimizing chemical mechanical planarization (CMP) processes for next-generation 3D NAND, improving process margins and manufacturability, and supporting transfer of solutions to manufacturing.

Experience Level

Senior-level. Guidance: minimum 1 year of relevant semiconductor industry experience is specified in the posting.

Responsibilities

Technical and leadership responsibilities include development, experimentation, and cross-functional coordination to enable next-generation 3D NAND CMP processes.

• Develop and optimize CMP processes to improve product quality and reliability for next-generation memory devices.
• Analyze and improve process margins to meet mature yield goals for 3D NAND.
• Perform fundamental research, consumables development, hardware evaluation, and process testing for novel applications.
• Design, initiate, and manage experiments to widen process margins and assess manufacturability of node solutions.
• Collaborate extensively with vendors on consumables and process integration for current and next-generation nodes.
• Incorporate manufacturing best practices into early development and transfer to production.
• Design and implement advanced process monitoring and control methodologies.
• Define and contribute to strategic roadmaps for N+, N++ and future NAND nodes; lead complex multi-functional projects and provide technical advisory to management.
• Mentor new hires and junior team members; engage with procurement, operations, and global partners to drive solutions.
• Integrate AI-assisted tools and insights where appropriate to improve efficiency and process outcomes, while complying with IP and legal standards.

Requirements

Must-have technical skills, practical experience, and key soft skills required for the role.

• Hands-on experience operating CMP equipment such as AMAT (LKP), EBARA-300X and next-generation CMP tools; experience with optical metrology, profilometry, polishing slurries, conditioners, and polishing pads.
• Experience in dielectrics and/or metals CMP process development on 3D NAND or other memory technologies.
• Understanding of integration and structural impacts related to film deposition and upstream/downstream processes.
• Proven ability to lead complex, multi-disciplinary projects and to provide technical guidance to management.
• Excellent oral and written communication skills; strong collaboration skills across local and international teams.
• Self-driven, adaptable, able to manage multiple projects, and willing to take calculated risks to implement novel solutions.
• Recognized mentor and technical expert with ability to solicit feedback and analyze outcomes.
• Preferred: familiarity with memory process flow for planar and vertical NAND; interest or experience in data science, modelling, and applying AI for workflow optimization.

Education Requirements

PhD in Materials Science, Chemical Engineering, Electrical Engineering, Mechanical Engineering, Chemistry, or Physics is specified, with a minimum of 1 year of relevant semiconductor industry experience and background in CMP in 300mm wafer fabrication.

About the Company

Company: Micron Technology

Headquarters: Boise, Idaho, USA

Micron Technology is a global leader in memory and storage solutions, dedicated to transforming how the world uses information. The company offers a diverse portfolio of high-performance DRAM, NAND, and NOR memory products under the Micron and Crucial brands. With a commitment to customer focus and technological innovation, Micron drives advancements in artificial intelligence, 5G, and other data-centric applications, empowering users to learn, communicate, and progress.