Senior Engineer, PD SG, Dry Etch, NAND

Job Title

Senior Engineer, PD SG, Dry Etch, NAND

Role Summary

Senior Process Development Engineer focused on dry etch process development for 3D NAND at Fab 10N/X in Singapore. The role leads development and troubleshooting of dry etch recipes and tools, drives process simplification, and integrates manufacturing-ready methods into early technology nodes.

The engineer will work cross-functionally with fabs, TD teams, and vendors to deliver new NAND process technologies and support device ramp readiness.

Experience Level

Senior-level. The posting specifies a minimum of approximately 3 years of semiconductor dry etch process development experience; the title and responsibilities indicate a senior role with leadership in process development and cross-functional coordination.

Responsibilities

Primary responsibilities include process development, tool evaluation, and cross-functional problem solving to enable NAND technology ramps.

• Rapidly deploy and scale new NAND dry etch process technologies.
• Drive development efforts prior to device ramp and meet defined performance timelines.
• Evaluate dry etch tool performance, define process windows, and refine etch recipes for 3D NAND.
• Troubleshoot process issues in cross-functional teams to improve yield and quality.
• Identify, own, and implement process improvement and simplification initiatives.
• Collaborate with other fabs and technology development teams to find viable solutions.
• Integrate best-known manufacturing methods into early development phases.
• Leverage AI and data-driven methods to streamline workflows, optimize processes, and support decision-making.

Requirements

Key qualifications and technical skills expected for successful candidates.

• Minimum ~3 years of hands-on semiconductor dry etch process development experience (posting indicates this as the experiential baseline).
• Proven record of technical output such as publications, patents, or invention disclosures.
• Experience with process development, tool evaluation, recipe optimization, and process window characterization for 3D NAND.
• Strong skills in statistics, data analysis, and Design of Experiments (DOE); comfortable with analysis software tools.
• Ability to troubleshoot complex process problems and drive yield/quality improvements.
• Effective collaboration with cross-functional teams and external vendors.
• Excellent written, verbal, and presentation communication skills.
• Comfort working in a fast-paced, dynamic development environment and applying AI/data-driven techniques to process optimization.

Education Requirements

PhD in Materials Science, Physics, Chemistry, Electrical/Electronics Engineering is listed as preferred. Alternatively, Bachelor's or Master's in Materials Science, Physics, Chemistry, Electrical/Electronics Engineering are acceptable when combined with a minimum of ~3 years of semiconductor dry etch process development experience. No specific certifications were listed.

About the Company

Company: Micron Technology

Headquarters: Boise, Idaho, USA

Micron Technology is a global leader in memory and storage solutions, dedicated to transforming how the world uses information. The company offers a diverse portfolio of high-performance DRAM, NAND, and NOR memory products under the Micron and Crucial brands. With a commitment to customer focus and technological innovation, Micron drives advancements in artificial intelligence, 5G, and other data-centric applications, empowering users to learn, communicate, and progress.