Senior Engineer, Package Design
TenstorrentJob Title
Senior Engineer, Package Design
Role Summary
Design board-level routing studies, create PCB mock-ups, and produce SI/PI and power integrity modeling collateral to support early-stage semiconductor package and package-board co-design. The role focuses on prototype routing environments, BGA optimization, package escape studies, and system-level electrical modeling rather than production PCB release.
Work closely with signal integrity, power integrity, mechanical, and system teams to translate package architecture and board implementation into representative electrical models and routing studies. This is a hybrid role based in Santa Clara, CA (primary), with additional locations in Austin, TX; Toronto, ON; and New Taipei City, TW.
Experience Level
Senior-level. Typical candidates have 3+ years of relevant PCB/package design experience (see Requirements). Final level and offer will be determined during the interview process.
Responsibilities
The engineer will support early-stage package and board co-design through modeling, prototyping, and collaboration across disciplines.
- Create board-level routing studies and PCB mock-ups to evaluate package escape and BGA routing strategies.
- Develop SI/PI and system-level electrical models and documentation for package and board interactions.
- Analyze routing congestion, layer utilization, and signal escape trade-offs for high-pin-count BGAs.
- Collaborate with signal integrity, power integrity, mechanical, and systems teams to iterate designs and validate assumptions.
- Produce modeling collateral and design recommendations that inform package architecture and board implementation.
- Apply automation, data analytics, or emerging AI techniques to improve routing and design workflows.
Requirements
Must-have and preferred skills for routinely performing the role.
- Must-have: 3+ years of experience with Cadence Allegro PCB Designer.
- Experience with high-pin-count BGAs and complex connectivity requirements.
- Working knowledge of signal integrity and power integrity principles.
- Ability to analyze routing congestion, layer utilization, and signal escape strategies.
- Strong communication skills and ability to collaborate across multiple engineering disciplines.
- Employment contingent on eligibility to access U.S. export-controlled technology; may require U.S. citizenship, permanent residency, or prior government license approval.
- Nice-to-have: experience with chiplets, 2.5D packaging, on/off-package memory, backside or vertical power delivery, integrated voltage regulators, package embedded passives, or applying automation/data analytics/AI to engineering workflows.
Education Requirements
Not specified.
About the Company
Company: Tenstorrent
Headquarters: Austin, Texas, United States
Tenstorrent is a technology company focused on designing innovative computing solutions. They are known for their expertise in the development of advanced hardware, including ASICs and SoCs, aimed at enhancing performance and efficiency in various applications.
