Senior Engineer, HIG-HBM Product Engineering (Media Health Reliability)

Job Title

Senior Engineer, HIG-HBM Product Engineering (Media Health Reliability)

Role Summary

Lead the High Bandwidth Memory (HBM) Product Engineering Media Health Reliability team to develop and execute intrinsic and extrinsic reliability test strategies for HBM products (DRAM, interface die, and stacked devices).

Drive DPM reduction, qualification execution, root-cause analysis of qual and RMA failures, and front-end process conversions through cross-functional collaboration with Fab, Technology Development, Quality, Design, and System teams.

Experience Level

Senior — requires prior semiconductor industry experience; posting indicates ~3+ years of relevant experience (product engineering experience preferred).

Responsibilities

Primary responsibilities include developing reliability test flows, managing qualification and quality activities, and leading root-cause and process improvement efforts.

• Define and develop reliability stresses, test flows, and test plans covering product reliability for DRAM, interface die, and stacked HBM products.
• Coordinate qualification plans and execution with Global Quality; track progress and resolve gating issues.
• Drive extrinsic (Time-0 and field) and intrinsic reliability DPM reduction via optimized manufacturing test flows and test strategies.
• Lead root-cause analysis for qualification and RMA issues using electrical failure analysis (EFA) and physical failure analysis (PFA); implement corrective actions and design/process improvements.
• Recommend and support front-end process conversions and HVM readiness to improve yield, cost, reliability, and performance.
• Manage risk with product leads during process conversions and prioritize technical risk mitigation.
• Promote technical innovation to maintain competitive advantage.
• Mentor and develop team members; build project management and technical decision-making capability within the team.
• Collaborate cross-functionally with Fab, HBM Technology Development, HBM Design, System Development, and Quality/Reliability teams.

Requirements

Must-have technical and leadership qualifications and work conditions.

• Strong leadership and hands-on technical problem-solving skills, including deep circuit-level analysis.
• Good knowledge of statistics, data analysis tools, and scripting for test and data evaluation.
• Proven ability to collaborate across teams to solve complex engineering and business problems.
• Excellent communication and presentation skills; strong sense of responsibility and professional work ethic.
• Self-motivated, flexible, and able to lead both people and technical programs.
• Experience with product engineering is preferred.
• Work on-site in Singapore; willing to travel internationally (US, Taiwan, Japan).

Education Requirements

Required: Bachelor's or Master's degree in Electrical and Electronics Engineering (Electrical/Electronics/related fields referenced). The posting additionally specifies semiconductor industry experience.

About the Company

Company: Micron Technology

Headquarters: Boise, Idaho, USA

Micron Technology is a global leader in memory and storage solutions, dedicated to transforming how the world uses information. The company offers a diverse portfolio of high-performance DRAM, NAND, and NOR memory products under the Micron and Crucial brands. With a commitment to customer focus and technological innovation, Micron drives advancements in artificial intelligence, 5G, and other data-centric applications, empowering users to learn, communicate, and progress.