Senior Engineer, HIG-HBM Product Engineering (Media Health Reliability)

Job Title

Senior Engineer, HIG-HBM Product Engineering (Media Health Reliability)

Role Summary

Lead the High Bandwidth Memory (HBM) Product Engineering Media Health Reliability team to develop and execute intrinsic and extrinsic reliability tests for HBM products (DRAM die, interface die, and stacked products). The role drives DPM reduction, intrinsic reliability margins, and optimized manufacturing test flows to meet quality, cost, and cycle-time KPIs.

Work cross-functionally with Fab, Technology Development, Design, System Development, and Global Quality to characterize reliability, identify gaps, execute root-cause resolution, and implement process improvements.

Experience Level

Senior level. The posting requests 5+ years of semiconductor industry experience in product, testing, or reliability roles.

Responsibilities

Primary responsibilities include test development, qualification management, reliability improvement, and technical leadership.

• Develop reliability stress tests, test flows, and test plans covering intrinsic and extrinsic product reliability.
• Lead qualification planning and execution with Global Quality; track progress and resolve gating issues.
• Reduce Time‑0 and field DPM and improve intrinsic reliability via optimized manufacturing test strategy.
• Perform root-cause analysis for qualification and RMA failures using electrical and physical failure analysis and drive corrective actions.
• Recommend and support front-end process conversions and HVM transitions to improve yield, cost, and reliability.
• Manage technical risk, make prioritization decisions, and communicate status with product leads.
• Build, mentor, and develop a high-performing reliability engineering team.
• Drive project management practices to ensure timely delivery of engineering objectives.
• Identify, pilot, and productionize ML/AI use cases for reliability datasets; embed AI/automation into reliability workflows.
• Collaborate cross-functionally with Fab, TD, Design, System, and Quality teams to meet strategic and tactical objectives.

Requirements

Key technical skills, industry experience, and professional behaviors expected for the role.

• Must-have: 5+ years in the semiconductor industry with product, testing, or reliability experience.
• Must-have: Practical experience with problem-solving and root-cause analysis methodologies.
• Must-have: Familiarity with CMOS technology, DRAM architecture, and basic device physics.
• Must-have: Experience with data analysis, statistics, and scripting (examples: Python, JMP).
• Must-have: Clear written and verbal English communication; attention to detail and ownership of tasks.
• Nice-to-have: Experience with EFA/PFA workflows, qualification test execution, and manufacturing test flow optimization.
• Nice-to-have: Practical experience applying machine learning (regression, classification, anomaly detection, clustering) to reliability or manufacturing datasets.
• Nice-to-have: Prior leadership, mentorship, or team-building experience in an engineering environment.

Education Requirements

Bachelor's or Master’s degree in Electrical and Electronics Engineering or a related technical field. The posting also references coursework or internship experience in semiconductor devices, circuit design, or product validation as advantageous.

About the Company

Company: Micron Technology

Headquarters: Boise, Idaho, USA

Micron Technology is a global leader in memory and storage solutions, dedicated to transforming how the world uses information. The company offers a diverse portfolio of high-performance DRAM, NAND, and NOR memory products under the Micron and Crucial brands. With a commitment to customer focus and technological innovation, Micron drives advancements in artificial intelligence, 5G, and other data-centric applications, empowering users to learn, communicate, and progress.