Senior Engineer, Advanced Process Development

Job Title

Senior Engineer, Advanced Process Development

Role Summary

Responsible for development, optimization, qualification, and transfer of hybrid bonding and advanced die-stacking assembly processes for HBM and next-generation products at Fab 16 in Taichung. Works cross-functionally with process integration, equipment, product, quality, manufacturing, materials, and suppliers to deliver NPI milestones and manufacturing readiness.

Experience Level

Senior-level. The role title indicates a senior engineer; explicit years of experience were not provided.

Responsibilities

Accountable for driving assembly process development from concept through qualification and manufacturing transfer, focusing on hybrid bonding and advanced stacking.

• Develop, optimize, and characterize hybrid bonding and advanced stacking assembly processes for HBM and next-generation products.
• Own process development lifecycle: feasibility, DOE, qualification, and transfer to manufacturing.
• Define process windows, run DOE and statistical analysis to improve process robustness and capability.
• Support C2W / advanced die-stacking integration and manage upstream/downstream process interactions.
• Create and maintain process specifications, control plans, qualification criteria, and manufacturing documentation.
• Lead equipment evaluation, tool qualification, and capability improvement with suppliers and equipment teams.
• Perform structured root-cause analysis for yield, quality, reliability, defects, and integration issues.
• Apply risk-analysis methodologies (pFMEA) during NPI and qualification activities.
• Support cross-site technology transfer, training, process-condition alignment, and ramp readiness.
• Drive continuous improvement in yield, quality, cost, cycle time, process capability, and equipment productivity.

Requirements

Key technical skills and experience required; preferred items listed separately.

• Hands-on experience in semiconductor assembly, wafer-level packaging, or advanced packaging process development, integration, or manufacturing engineering.
• Proven use of DOE, SPC, process capability metrics, and statistical data analysis.
• Experience with FMEA/pFMEA and structured problem-solving (8D, Five Whys, Kepner-Tregoe).
• Ability to perform failure analysis, root-cause identification, and process optimization.
• Practical experience with NPI, process qualification, change control, and technology transfer.
• Ability to establish process windows and convert development results into manufacturable process controls.
• Familiarity with applying AI tools to support engineering tasks and data analysis.

• Experience with hybrid bonding, direct bonding, Cu-Cu bonding, C2W/W2W, or high-accuracy die stacking.
• Deep understanding of bond-interface factors: surface prep, contamination control, alignment accuracy, warpage, and post-bond inspection.
• Experience with upstream/downstream assembly processes: wafer prep, cleaning, dicing, thinning, handling, encapsulation, and metrology.
• Experience in HBM or advanced packaging manufacturing environments.

Education Requirements

Bachelor's or Master's degree in Materials Science, Mechanical Engineering, Chemical Engineering, Electrical Engineering, Semiconductor Engineering, Physics, or a related discipline.

About the Company

Company: Micron Technology

Headquarters: Boise, Idaho, USA

Micron Technology is a global leader in memory and storage solutions, dedicated to transforming how the world uses information. The company offers a diverse portfolio of high-performance DRAM, NAND, and NOR memory products under the Micron and Crucial brands. With a commitment to customer focus and technological innovation, Micron drives advancements in artificial intelligence, 5G, and other data-centric applications, empowering users to learn, communicate, and progress.