Senior Engineer, Advanced Packaging - Fail-Mode Metric Reaction (FMR)

Job Title

Senior Engineer, Advanced Packaging - Fail-Mode Metric Reaction (FMR)

Role Summary

Owner of the fail-mode metric reaction loop for advanced packaging products: analyze yield and failure signatures, correlate electrical data with physical failure analysis, and drive corrective and preventive actions across process, build, and reliability partners.

Work with packaging process, FA labs, test/silicon engineering, and product teams to shorten time-to-signature by building scalable data pipelines, dashboards, and automated workflows.

Experience Level

Senior-level engineer. The posting indicates 3–5 years of relevant industry experience in advanced packaging, failure analysis, yield engineering, or closely related semiconductor fields.

Responsibilities

Key responsibilities include technical analysis, cross-functional reaction planning, and automation to scale responses.

• Perform yield analysis for advanced packaging test vehicles and production products; break down defect signatures by fail mode, location, layer, and process step.
• Investigate and root-cause fail modes and mechanisms at time-zero; correlate electrical signatures with physical FA results.
• Drive reaction plans for internal reliability fails and customer RMAs; convert failure understanding into containment, corrective, and preventive actions.
• Partner with process, FA, PSE, and TSE teams for excursion triage, FA planning, test coverage, and disposition decisions.
• Build and maintain data analysis pipelines, dashboards, and automated workflows to scale FMR response and shorten time-to-signature.
• Apply AI/ML techniques for signature classification, anomaly detection, and workflow automation.
• Present technical findings and reaction plans to leaders across multiple functions.

Requirements

Must-have technical skills and experience.

• Hands-on experience with advanced packaging fail modes (bump/interconnect, TSV, RDL, underfill, warpage, delamination, EM/TDDB-related package failures).
• Strong data analysis skills with Python, SQL, JMP, or equivalent tools for high-volume manufacturing/test data.
• Experience applying AI/ML and automation to engineering workflows and signature classification.
• Proven experience driving FA-to-fix loops and coordinating corrective actions with process and product teams.
• Ability to design FA sample plans, prioritize investigations, and interpret physical FA results in context of electrical signatures.

Preferred:

• Familiarity with package reliability stress methodologies and their failure signatures (HTOL, TC, uHAST, etc.).

Education Requirements

MS or PhD in Electrical Engineering, Materials Science, Physics, or a closely related field, or equivalent practical experience; the posting explicitly allows equivalent experience in lieu of degree.

About the Company

Company: Micron Technology

Headquarters: Boise, Idaho, USA

Micron Technology is a global leader in memory and storage solutions, dedicated to transforming how the world uses information. The company offers a diverse portfolio of high-performance DRAM, NAND, and NOR memory products under the Micron and Crucial brands. With a commitment to customer focus and technological innovation, Micron drives advancements in artificial intelligence, 5G, and other data-centric applications, empowering users to learn, communicate, and progress.