Senior Director, Silicon Hardware Engineering - Boards, Packaging, & Reliability

Job Title

Senior Director, Silicon Hardware Engineering - Boards, Packaging, & Reliability

Role Summary

Lead a global engineering organization responsible for chip package development, board hardware development, and silicon power & reliability engineering. Report to the VP of Engineering and define technical strategy, development methodologies, and organizational capabilities to deliver high-performance, reliable silicon hardware at scale.

This role combines technical leadership in advanced semiconductor packaging and board design with operational ownership of program delivery, vendor management, and cross-functional alignment across U.S. and Asian sites.

Experience Level

Senior - requires extensive leadership experience. The posting requests 15+ years of progressive semiconductor hardware engineering experience with at least 5 years in a senior leadership or director-level role.

Responsibilities

Own technical direction, team development, and program execution for packaging, board hardware, and silicon reliability.

• Lead and scale engineering teams across the U.S. and Asia covering package, board, SI/PI, power, and reliability.
• Define multi-year technical roadmaps, headcount plans, KPIs, and engineering standards.
• Set technical direction for advanced package technologies (2.5D/3D IC, flip-chip, high-density interconnect) and substrate design.
• Oversee board-level development from concept through bring-up, emphasizing DFM and DFT.
• Champion signal integrity (SI) and power integrity (PI) methodologies and adoption of EDA tools.
• Lead silicon power and reliability programs (power budgeting, electromigration, ESD, qualification).
• Drive disciplined technical reviews and early risk identification across package, board, and silicon activities.
• Manage multi-vendor relationships, supplier qualification, scorecards, and escalation processes.
• Deliver on-time, on-budget program execution and continuous improvement in cycle time and cost.

Requirements

Must-have technical skills, leadership experience, and operational capabilities.

• 15+ years in semiconductor hardware engineering with demonstrated leadership of global, cross-functional teams.
• Proven experience in chip package development, advanced packaging, substrate design, and OSAT/vendor management.
• Proven experience in board hardware development including schematics, PCB layout, and bring-up.
• Strong hands-on expertise in SI and PI analysis and methodologies; familiarity with tools such as Ansys SIwave, Cadence Sigrity, HyperLynx, or equivalent.
• Solid understanding of silicon design development flow (synthesis, place & route, timing closure, DFT).
• Track record of driving cost-reduction programs across packaging and board hardware without sacrificing quality.
• Experience managing and qualifying multiple external vendors and OSATs concurrently.
• Proven ability to drive complex engineering programs, make technical decisions across organizations, and present to senior leadership.

Education Requirements

Bachelor's degree in Electrical Engineering, Computer Engineering, or a closely related field is required; Master’s degree preferred.

About the Company

Company: Altera

Headquarters: Bengaluru, Karnataka, India

Altera provides leadership programmable solutions for applications ranging from cloud to edge, unveiling limitless AI possibilities. Their extensive product portfolio includes FPGAs, CPLDs, Intellectual Property, development tools, and System on Modules aimed at accelerating innovation in various fields.