Senior Director, Package Design Engineering
RenesasJob Title
Senior Director, Package Design Engineering
Role Summary
Lead a global Technical Program Management organization for AI/Datacenter Infrastructure Power package engineering and NPI programs, coordinating internal teams and OSAT/CM partners to deliver quality, reliable products on schedule.
Establish program governance, drive risk identification and mitigation, lead cross-functional technical task forces, and standardize program-management processes across development, qualification, and production ramp.
Experience Level
Senior - 15–20+ years of relevant semiconductor engineering, NPI, package development, or technical program management experience.
Responsibilities
Accountable for end-to-end program execution, risk mitigation, and organizational leadership for package NPI and production ramp.
- Lead the global TPM organization supporting AI/Datacenter Power NPI and package engineering programs.
- Define and manage NPI program plans, milestones, critical paths, resources, and executive reporting.
- Establish program governance, dashboards, metrics, and escalation mechanisms.
- Identify technical, quality, reliability, manufacturing, and schedule risks; drive mitigation and escalation.
- Lead cross-functional task forces to resolve issues affecting quality, reliability, yield, manufacturability, or schedule.
- Coordinate with Package Engineering, Design, Product, Reliability, Quality, Operations, Supply Chain, and OSAT/CM partners.
- Drive execution of Engineering Build Requests (EBRs) and production ramp readiness at OSATs.
- Develop TPM teams at strategic OSAT locations and build relationships with external partners.
Requirements
Must-have skills and experience required for effective performance in this role.
- Proven leadership of complex semiconductor NPI and package development programs.
- Deep knowledge of package and assembly processes, qualification, reliability, and manufacturing ramp.
- Experience working with OSATs/CMs and managing distributed development and production activities.
- Strong program management: critical-path management, risk management, schedule recovery, and executive escalation.
- Structured problem solving, root-cause analysis, SPC/statistical methods, and risk assessment skills.
- Excellent communication, negotiation, and ability to influence senior technical and business leaders.
- Experience building and leading global teams, including teams embedded at external manufacturing locations.
- Analytical ability to translate technical issues into business impact and decisions.
Nice-to-have:
- Experience with Smart Power Stage, Vertical Power Stage, power modules, SiC/GaN, DBC/AMB, multi-chip, wafer-level, or advanced interconnect technologies.
- Experience with portfolio-level governance and formal TPM methodologies.
- Experience supporting high-growth customer programs and fast-paced NPI.
Education Requirements
Doctorate, Master's, or Bachelor's degree in Electrical Engineering, Materials Science, Physics, Chemistry, or a related technical discipline.
About the Company
Company: Renesas
Headquarters: Hitachinaka, Japan
Renesas is a global leader in embedded semiconductor solutions, providing high-quality products across automotive, industrial, infrastructure, and IoT sectors. With over 22,000 employees in more than 30 countries, the company focuses on scalable solutions that enhance user experience and drive innovation while committed to sustainability and energy efficiency.
