Senior Director, Package & Assembly Engineering

Job Title

Senior Director, Package & Assembly Engineering

Role Summary

Lead the global organization responsible for packaging development, new product introduction (NPI), assembly engineering, and continuous improvement across internal teams and OSAT/CM partners. Ensure programs meet schedule, quality, reliability, and production-readiness objectives through strong program governance and cross-functional execution.

Experience Level

Senior - typically 15–20+ years of relevant semiconductor engineering and program management experience.

Responsibilities

Provide leadership and hands-on program execution to deliver packaging NPI and production ramps while managing risks and cross-functional issues.

• Recruit, build, and mentor a global packaging and assembly engineering team.
• Drive end-to-end NPI program plans, milestones, critical paths, resource alignment, and executive reporting.
• Establish program governance, dashboards, and standardized processes for development, qualification, ramp, and transition to volume manufacturing.
• Identify technical, quality, reliability, supply, manufacturing, and schedule risks; define mitigation and escalate critical issues with recommended decisions.
• Lead cross-functional technical task forces to resolve issues threatening quality, reliability, yield, manufacturability, or schedule.
• Coordinate closely with Package Engineering, Design, Product, Reliability, Quality, Operations, Supply Chain, and marketing partners to remove execution barriers.
• Manage technical program activities with OSAT/CM partners: reviews, milestone tracking, qualification readiness, and ramp execution.
• Ensure execution of Engineering Build Requests (EBRs) and drive recovery actions for delays.
• Translate package technology roadmap priorities into executable development programs and deliverables.
• Provide concise, fact-based executive communication on program health, risks, schedule recovery, and resource needs.

Requirements

Core qualifications and skills required to perform the role.

• 15–20+ years of experience in semiconductor engineering, package development, NPI, manufacturing, or technical program management.
• Proven experience leading complex semiconductor NPI programs involving package development, assembly, qualification, reliability, and manufacturing ramp.
• Experience working directly with OSAT/CM partners and managing distributed development and production activities.
• Strong program management skills: critical-path management, risk management, schedule recovery, and executive escalation.
• Demonstrated ability to lead cross-functional teams and technical task forces to close critical issues (root-cause analysis, corrective/preventive actions).
• Knowledge of qualification, reliability methods, SPC/statistical analysis, process development, and process-window verification.
• Strong interpersonal, communication, negotiation, and executive presentation skills; ability to influence without direct authority.
• Experience building and leading global teams, including those embedded at external manufacturing or OSAT locations.
• Willingness and ability to relocate to / be based in India for a 2-year project assignment.

Nice-to-have:

• Experience supporting high-growth customer programs and portfolio-level governance.
• Familiarity with formal technical program management methodologies.

Education Requirements

Doctorate, Master’s, or Bachelor’s degree in Electrical Engineering, Materials Science, Physics, Chemistry, or a related technical discipline (or equivalent technical experience).

About the Company

Company: Renesas

Headquarters: Hitachinaka, Japan

Renesas is a global leader in embedded semiconductor solutions, providing high-quality products across automotive, industrial, infrastructure, and IoT sectors. With over 22,000 employees in more than 30 countries, the company focuses on scalable solutions that enhance user experience and drive innovation while committed to sustainability and energy efficiency.