Senior Director, Optical Packaging Technology (OPT) Development

Job Title

Senior Director, Optical Packaging Technology (OPT) Development

Role Summary

Lead the Optical Packaging Technology (OPT) Development function within Integrated Optics to define technical and operational strategy across advanced packaging, optics, and product engineering. Build and lead the OPT organization, set roadmaps, and align cross-functionally to deliver manufacturable optical/photonic modules.

Experience Level

Senior-level. Requires 15+ years of progressive experience in semiconductor or photonics packaging, including advanced packaging and optical/photonic integration.

Responsibilities

Accountable for technical direction, organization building, partner management, and product qualification for optical packaging and integration.

• Define and own the OPT technical strategy and roadmap across advanced packaging, optics, and product engineering.
• Lead package design and assembly architecture for optical/photonic modules (substrate, interposer, co-packaging).
• Drive yield enhancement programs using SPC and root-cause analysis to close packaging and assembly yield gaps.
• Own packaging qualification and reliability strategy, including test plans, stress testing, and reliability modeling.
• Direct optics technical roadmap: optics/laser solutions, optical alignment, fiber attach, and co-packaged optics integration.
• Oversee product engineering investigations, returns analysis, and failure analysis to drive design/process changes.
• Partner with test engineering to develop test strategy, coverage, and qualification requirements.
• Set technical requirements and provide engineering oversight for external assembly/test partners; review process capability, yield, and quality data.
• Evaluate and down-select advanced packaging and optical integration technologies for the technology roadmap.
• Collaborate with Silicon Products Development on EIC/PIC and optical engine architecture for package-silicon co-design.

Requirements

Key professional requirements and competencies. Education requirements are listed separately below.

• 15+ years progressive experience in semiconductor or photonics packaging with significant time in advanced packaging and/or optical/photonic integration.
• Proven track record building or scaling technical organizations and hiring senior technical leaders.
• Deep technical expertise in advanced packaging (assembly, package design, yield, qualification/reliability) and/or optical packaging (fiber attach, co-packaged optics).
• Experience managing outsourced assembly and test (OSAT) partners and evaluating external supplier capabilities.
• Demonstrated executive presence with experience partnering with senior leadership, customers, and global cross-site teams.
• Ability to operate effectively in a matrixed, multi-site global organization.
• Strong communication, organizational design, and change-leadership skills.

Preferred:

• Comfortable operating in a multicultural, matrixed environment and leading through influence.
• Alignment with values of integrity, innovation, and operational excellence.

Education Requirements

Bachelor's degree in engineering, Materials Science, Physics, or a related field is required; an advanced degree (MS or PhD) is strongly preferred. (The posting does not state explicit equivalent-experience language.)

About the Company

Company: GlobalFoundries

Headquarters: Saratoga Springs, New York, USA

GlobalFoundries is a leading contract manufacturer for the global semiconductor industry, with facilities in multiple countries, including the USA. The company develops a broad portfolio of semiconductor technologies and employs around 13,000 people worldwide. GlobalFoundries focuses on enhancing competitiveness in specialized application solutions and fostering innovation in mobile communications, consumer electronics, and automotive applications.