Senior Director, Boards, Packages & Reliability

Job Title

Senior Director, Boards, Packages & Reliability

Role Summary

Lead a global, distributed hardware engineering organization responsible for chip package development, board design, and silicon power & reliability engineering. Report to the VP of Engineering and own technical strategy, program execution, and operational performance to deliver reliable silicon products at scale.

The role requires combining hands-on technical expertise in advanced packaging and board design with proven cross-functional leadership and vendor management across US and Asia sites.

Experience Level

Senior — senior leadership position. Requires 15+ years of progressive semiconductor hardware engineering experience, including at least 5 years in a director-level or equivalent leadership role.

Responsibilities

Accountable for technical leadership, program delivery, and organizational development across packaging, board, and reliability functions.

• Lead and grow engineering teams in chip package development, board development, and silicon power & reliability across US and Asia.
• Define multi-year hardware roadmaps, headcount plans, KPIs, and organizational strategy in partnership with senior leadership.
• Drive technical decisions for advanced packaging (2.5D/3D IC, flip-chip, HDI) and oversee board design from concept to bring-up with DFM/DFT focus.
• Champion signal integrity (SI) and power integrity (PI) methodologies and adoption of best-in-class EDA tooling across teams.
• Lead silicon power and reliability programs: power budgeting, electromigration, ESD, and reliability qualification.
• Manage end-to-end program execution across multiple concurrent programs to meet schedule, quality, and cost targets.
• Develop and execute cost-reduction strategies for packaging, board materials, and test processes.
• Manage complex multi-vendor relationships (OSATs, PCB fabricators, substrate suppliers, EDA vendors) and implement supplier qualification and scorecard processes.
• Represent hardware engineering in executive reviews, customer engagements, and cross-functional technical tradeoff discussions.

Requirements

Must-have technical skills, leadership experience, and operational capabilities.

• 15+ years in semiconductor hardware engineering with significant experience in packaging, board design, and reliability engineering (education details under Education Requirements).
• 5+ years in senior leadership or director-level roles managing global, cross-functional teams across US and Asian sites.
• Deep experience in chip package development (advanced packaging, substrate design, OSAT management).
• Proven experience in board-level hardware development including schematic, layout, and bring-up.
• Strong hands-on background with SI/PI analysis tools (examples include Ansys SIwave, Cadence Sigrity, HyperLynx).
• Solid understanding of silicon design development methodologies (synthesis, place & route, timing closure, DFT).
• Track record of delivering cost-reduction initiatives and managing multiple external vendors and OSATs.
• Excellent communication and executive presentation skills; ability to explain technical tradeoffs to non-technical stakeholders.

Nice-to-have:

• Experience with 2.5D/3D IC integration and high-density interconnect technologies.
• Prior experience operating in Taiwan, South Korea, Japan or other Asia-based engineering sites.

Education Requirements

Required: B.S. in Electrical Engineering, Computer Engineering, or a closely related technical field. Preferred: M.S. in a related field. (No certifications or equivalent-experience language was specified.)

About the Company

Company: Altera

Headquarters: Bengaluru, Karnataka, India

Altera provides leadership programmable solutions for applications ranging from cloud to edge, unveiling limitless AI possibilities. Their extensive product portfolio includes FPGAs, CPLDs, Intellectual Property, development tools, and System on Modules aimed at accelerating innovation in various fields.