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Senior Director, Applications Engineering - 3DIC & Advanced Packaging

Synopsys
October 23, 2026
Full-time
Remote
United States
$227,000 - $341,000 USD yearly
EDA Jobs, Level - Senior

Job Title

Senior Director, Applications Engineering - 3DIC & Advanced Packaging

Role Summary

Lead the Americas application engineering (AE) organization for Synopsys' 3DIC and advanced packaging portfolio. The role sets technical strategy for customer engagement, drives technical sales campaigns, resolves high‑stakes escalations, and aligns field needs with product and R&D roadmaps.

Experience Level

Senior - requires extensive senior leadership experience (10+ years in application engineering or customer‑facing semiconductor/EDA roles, with at least 5 years leading teams).

Responsibilities

Primary responsibilities include building and operating a high‑performing, senior AE organization and driving technical wins in 3DIC and advanced packaging accounts.

  • Lead and scale the Americas AE team supporting 3DIC and advanced packaging solutions.
  • Define how AE engages customers from evaluation through production deployment.
  • Drive customer discovery, opportunity qualification, and technical sales campaigns that produce design wins and revenue.
  • Recruit, develop, and manage senior application engineers who operate independently with customers.
  • Partner with sales, product, and R&D to translate field requirements into product priorities.
  • Own and resolve customer escalations and technical roadblocks at the executive level.
  • Travel regularly across the region to support customers and assess field performance (up to ~40% travel).

Requirements

Must-have skills and experience to perform the role effectively; nice-to-have items follow.

  • 10+ years in application engineering, technical sales, or customer-facing roles in EDA/semiconductor domains.
  • At least 5 years' experience leading and scaling technical teams, including hiring and retention of senior talent.
  • Deep technical expertise in digital implementation, 3DIC design construction, and multi‑physical analysis.
  • Proven record of driving new business acquisition, competitive displacement, and measurable revenue impact.
  • Experience managing geographically distributed teams and mentoring senior technical leaders.
  • Strong understanding of 3DIC, advanced packaging, and the semiconductor design ecosystem.
  • Willingness and ability to travel extensively (up to 40% travel across the region).
  • Nice to have: hands-on experience integrating EDA and multi‑physics solutions (e.g., Synopsys + Ansys workflows).

Education Requirements

Not specified.


About the Company

Company: Synopsys

Headquarters: Mountain View, California, USA

Synopsys is a leading company in electronic design automation (EDA) and semiconductor IP solutions. It provides tools and services for designing and verifying complex semiconductor devices and systems. The company plays a pivotal role in the semiconductor industry, helping engineers innovate and deliver higher-quality products faster. Synopsys is committed to advancing technology standards and offers a range of software and hardware solutions to its clients globally.

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Date Posted: 2026-10-19