Senior Design Engineer, HBM

Job Title

Senior Design Engineer, HBM

Role Summary

Senior engineer responsible for design, simulation, and validation of High-Bandwidth Memory (HBM) architectures and circuit blocks. The role focuses on DRAM design, 3D-stacked architectures, wide I/O interfaces, PHY timing, power integrity, and system co-optimization with GPUs/accelerators.

Works across design, verification, product engineering, test, process integration, assembly, and marketing to deliver manufacturable, high-performance memory products.

Experience Level

Senior-level. The posting specifies 3 years of DRAM design or verification experience.

Responsibilities

The primary responsibilities include architecture, block-level design, verification, and cross-functional support for HBM products.

• Design, optimize, and validate memory, logic, analog, or mixed-signal circuits used in HBM products, including PHY-adjacent or subsystem logic.
• Contribute to HBM architecture definition, block-level specifications, and design tradeoff analysis across performance, power, area, and reliability.
• Perform pre-layout and post-layout simulation, modeling, and analysis to ensure robust design margins.
• Support tape-out activities, ECOs, and reticle experiments as required.
• Support post-silicon bring-up, failure analysis, and design correlation when required.
• Work closely with layout engineers on floorplanning, placement, routing, and design-rule compliance.
• Review parasitics, EM/IR, and reliability results; drive design or layout fixes as needed.
• Participate in functional, timing, and power verification and collaborate with design verification teams to review test plans, debug failures, and close coverage gaps.

Requirements

Key technical skills, tools, and experience required or beneficial for success in this role.

Must-have:

• Prior experience in HBM, DRAM, high-speed I/O, or memory-related designs.
• Understanding of DRAM array control and high-speed circuit design.
• Experience in functional verification and timing analysis for mixed-signal designs.
• Familiarity with device reliability, mitigation technologies, and reliability verification flows.
• Experience with analog/digital simulation tools such as HSPICE, Verilog, and PrimeSim.
• Practical problem-solving and analytical skills applied to silicon design and bring-up.
• 3 years of DRAM design or verification experience (as specified in the posting).

Nice-to-have:

• Experience with 3D-stacked architectures, through-silicon vias (TSVs), wide I/O interfaces, or PHY-adjacent logic.
• Experience applying AI/ML-enabled tools to improve productivity, verification coverage, or design quality.
• Familiarity with layout constraints, floorplanning, and foundry/packaging manufacturability requirements.

Education Requirements

MS in Computer Engineering or a related field (Master's degree explicitly specified).

About the Company

Company: Micron Technology

Headquarters: Boise, Idaho, USA

Micron Technology is a global leader in memory and storage solutions, dedicated to transforming how the world uses information. The company offers a diverse portfolio of high-performance DRAM, NAND, and NOR memory products under the Micron and Crucial brands. With a commitment to customer focus and technological innovation, Micron drives advancements in artificial intelligence, 5G, and other data-centric applications, empowering users to learn, communicate, and progress.