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Senior Design Engineer, HBM

Micron Technology
August 17, 2026
Full-time
On-site
Richardson, Texas, United States
ASIC Design Jobs, Level - Senior

Job Title

Senior Design Engineer, HBM

Role Summary

Member of Micron's Heterogeneous Integration Group (HIG) focused on design and sustaining of High Bandwidth Memory (HBM) products for AI/ML, HPC, and data-centric systems. Work spans design, verification, silicon debug, and cross-functional coordination with architecture, product engineering, process integration, packaging, and technology development.

Primary mission: identify and resolve silicon and system issues, implement design updates and ECOs, and support product lifecycle activities to maintain performance, yield, and reliability.

Experience Level

Senior-level role (title indicates senior). The posting specifies advanced degree options (see Education Requirements); technical seniority expected to independently drive complex issues to closure.

Responsibilities

Accountabilities include new-product design support, sustaining, cross-functional issue resolution, and continuous improvement of design and verification practices.

  • Participate in new HBM product design and collaborate with architecture on specifications and implementation.
  • Own sustaining activities for one or more products through lifecycle, including ECOs and spec changes.
  • Lead root-cause analysis and resolution for silicon, system, and customer issues; coordinate reticle revisions as needed.
  • Work cross-functionally with Architecture, Design Engineering, PSE, TD, and system teams to prioritize and execute fixes.
  • Identify and debug yield, reliability, timing, and performance issues to improve product quality.
  • Support customer bring-up, qualification, and system-level debug activities.
  • Capture sustaining learnings to improve design quality, debug efficiency, and verification methodologies.

Requirements

Key technical skills and practical experience required for the role. Education items are listed separately under Education Requirements.

Must-have:

  • Strong understanding of DRAM/HBM architecture and high-speed memory interfaces.
  • Experience in digital and/or custom design and verification.
  • Hands-on silicon debug or post-silicon validation experience.
  • Proven ability to independently drive complex technical issues to closure.
  • Proficiency using AI-assisted tools (e.g., Claude Code or similar) to improve design quality and efficiency.

Nice-to-have:

  • Experience with HBM/DDR/LPDDR or other high-speed I/O systems.
  • System-level debug and silicon-to-system correlation experience.
  • Knowledge of timing and margin analysis, signal and power integrity.
  • Experience with DFT, mBIST, and test-mode debug.
  • Programming/scripting skills (Python preferred) for debug automation.
  • Strong communication skills for cross-functional collaboration.

Education Requirements

Ph.D. OR 2+ years of experience with an M.S. in Electrical Engineering, Computer Engineering, or a related technical field (as stated in the posting).


About the Company

Company: Micron Technology

Headquarters: Boise, Idaho, USA

Micron Technology is a global leader in memory and storage solutions, dedicated to transforming how the world uses information. The company offers a diverse portfolio of high-performance DRAM, NAND, and NOR memory products under the Micron and Crucial brands. With a commitment to customer focus and technological innovation, Micron drives advancements in artificial intelligence, 5G, and other data-centric applications, empowering users to learn, communicate, and progress.

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Date Posted: 2026-08-17