Senior Design Engineer, HBM
Member of Micron's Heterogeneous Integration Group (HIG) focused on design and sustaining of High Bandwidth Memory (HBM) products for AI/ML, HPC, and data-centric systems. Work spans design, verification, silicon debug, and cross-functional coordination with architecture, product engineering, process integration, packaging, and technology development.
Primary mission: identify and resolve silicon and system issues, implement design updates and ECOs, and support product lifecycle activities to maintain performance, yield, and reliability.
Senior-level role (title indicates senior). The posting specifies advanced degree options (see Education Requirements); technical seniority expected to independently drive complex issues to closure.
Accountabilities include new-product design support, sustaining, cross-functional issue resolution, and continuous improvement of design and verification practices.
Key technical skills and practical experience required for the role. Education items are listed separately under Education Requirements.
Must-have:
Nice-to-have:
Ph.D. OR 2+ years of experience with an M.S. in Electrical Engineering, Computer Engineering, or a related technical field (as stated in the posting).
Company: Micron Technology
Headquarters: Boise, Idaho, USA
Micron Technology is a global leader in memory and storage solutions, dedicated to transforming how the world uses information. The company offers a diverse portfolio of high-performance DRAM, NAND, and NOR memory products under the Micron and Crucial brands. With a commitment to customer focus and technological innovation, Micron drives advancements in artificial intelligence, 5G, and other data-centric applications, empowering users to learn, communicate, and progress.
