Job Title
Senior Design Engineer
Role Summary
Senior Design Engineer in the NVE Design Engineering Core group responsible for designing and analyzing core and mixed-signal circuits for NAND Flash memory and Compute-in-Memory (CIM) features. Work includes developing array waveforms, circuit architecture and integration, simulation, and collaboration with firmware, analog, and validation teams to deliver manufacturable memory products.
Experience Level
Senior β requires 4+ years of NAND-design-relevant experience and prior involvement in CIM projects.
Responsibilities
Key responsibilities focus on array-level circuit design, simulation, tool automation, documentation, and cross-functional integration for NAND and CIM features.
- Develop array waveforms with detailed timing and bias conditions for NAND Flash operation and CIM / near-memory compute modes.
- Collaborate with firmware, analog, and design validation teams during waveform implementation and integration.
- Plan wordline and bitline path architecture to meet area, performance, and power targets; determine placement and integrate blocks into chip plans.
- Perform die-size, cost, and benefit analyses for new array circuits and algorithms; evaluate and improve NAND power consumption.
- Create Xpath, Ypath, and array schematics; run block-, subsystem-, and full-chip simulations using SPICE and other tools; oversee layout implementation.
- Build and maintain Python-based utilities that interface with EDA environments to automate design tasks and accelerate development.
- Author and review technical documentation and support prototype/pathfinding efforts for CIM use cases.
- Coordinate with Product Engineering, Test, Probe, Process Integration, Assembly, and Marketing to ensure manufacturability, testability, and product readiness.
Requirements
Minimum technical skills and experience required; preferred skills listed separately.
Must-have:
- 4+ years of NAND-design-relevant experience with prior CIM project involvement.
- Strong fundamentals in semiconductor/device physics and analog/mixed-signal circuit design.
- Understanding of semiconductor reliability issues (CHC, NBTI, stress, snapback) and EM/IR analysis.
- Strong circuit debugging, verification, and optimization skills; experience with parasitic extraction and guiding layout.
- Proficiency in Python; familiarity with structured data (CSV/JSON/SQLite) and version control. Bash/Tcl experience is a plus.
Nice-to-have / Preferred:
- Experience with analog/digital simulators (HSPICE, Fast SPICE) and Verilog.
- Familiarity with Cadence design flows and LVS/DRC tools.
- Comfortable with Linux/UNIX environments and additional scripting languages.
Education Requirements
MS in Electrical Engineering required; PhD preferred. Fields explicitly referenced: electrical engineering and related technical disciplines. (The posting specifies degree expectations rather than an "equivalent experience" alternative.)
About the Company
Company: Micron Technology
Headquarters: Boise, Idaho, USA
Micron Technology is a global leader in memory and storage solutions, dedicated to transforming how the world uses information. The company offers a diverse portfolio of high-performance DRAM, NAND, and NOR memory products under the Micron and Crucial brands. With a commitment to customer focus and technological innovation, Micron drives advancements in artificial intelligence, 5G, and other data-centric applications, empowering users to learn, communicate, and progress.

Date Posted: 2026-05-07