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Senior Co-packaged Optics Process Engineer

NVIDIA
May 20, 2026
Full-time
On-site
Hsinchu, Taiwan
Process Engineering Jobs, Level - Senior

Job Title

Senior Co-packaged Optics Process Engineer

Role Summary

The Senior Co-packaged Optics Process Engineer will develop and maintain optical assembly and alignment processes for co-packaged optics (CPO) products, ensuring stable high-volume manufacturing. The role partners with IC product engineering, test engineering, operations, and external assembly/test vendors to qualify processes, resolve production issues, and improve yield and throughput.

Experience Level

Senior — requires experienced engineer with demonstrated production and process development background (posting specifies 5+ years).

Responsibilities

Primary responsibilities focus on process readiness, yield improvement, and onsite support for CPO mass production.

  • Ensure end-to-end assembly process readiness for CPO products at manufacturing partners.
  • Collaborate with R&D, product engineering, test engineering, and Operations to enable robust manufacturing and reliable products.
  • Monitor yields and drive continuous improvement initiatives for NPI and mass-production lines to meet capacity and cost targets.
  • Improve product quality by refining design-for-manufacturing, process flows, and equipment stability.
  • Provide onsite engineering support and technical ownership for process or equipment issues during ramp and production.

Requirements

Must-have skills and experience are listed below; nice-to-have items follow.

  • Must-have: 5+ years experience in mass production, optical alignment process development, and data processing & analysis.
  • Experience bringing new technology from R&D to high-volume manufacturing; hands-on debug and strong problem-solving skills.
  • Proficient in SPC, Six Sigma principles, and quality control processes; solid understanding of machine–process interactions.
  • Strong English communication and presentation skills; able to work independently and operate with urgency in fast-paced environments.
  • Nice-to-have: knowledge of flip-chip packaging, multi-chip modules, hybrid bonding, optical connector assembly, or connector-to-chip attach.
  • Hands-on experience optimizing process recipes and equipment; familiarity with DFx, FMEA, failure analysis, yield analysis, and cycle-time reduction.
  • Experience working with OSATs in volume manufacturing and background in semiconductor or optical communications industries.

Education Requirements

BS or MS degree in Mechanical Engineering, Optical Engineering, Materials Science, or a related field.


About the Company

Company: NVIDIA

Headquarters: Santa Clara, California, USA

NVIDIA is a global leader in accelerated computing, renowned for its innovative solutions in AI and digital twins that transform diverse industries. The company specializes in networking technologies, providing end-to-end InfiniBand and Ethernet solutions for servers and storage that optimize performance and scalability. NVIDIA serves sectors such as high-performance computing, enterprise data centers, and cloud computing, constantly reinventing its products and services to stay ahead in the market.

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Date Posted: 2026-05-19