Senior CAD Engineer – Physical Design Signoff
Intel CorporationJob Title
Senior CAD Engineer – Physical Design Signoff
Role Summary
Lead development and deployment of signoff methodologies and automation for advanced CPU and SoC physical-design signoff. Work with Physical Design, Timing, Power, Reliability, and CAD teams to improve signoff quality, productivity, and turnaround time.
Experience Level
Senior - requires 8+ years of industry experience in Physical Design, Signoff, CAD, or Design Automation.
Responsibilities
Primary responsibilities include building automation, resolving signoff issues, and improving methodology and reporting.
- Develop and enhance automation solutions for signoff flows: RC extraction, STA, ERC, power integrity (IR Drop/EM), and signal integrity.
- Create scalable automation frameworks to reduce signoff turnaround and improve productivity.
- Develop scripts and tools for signoff checks, debugging, reporting, and data analysis.
- Analyze and resolve timing, extraction, ERC, and power signoff issues with design teams.
- Drive methodology improvements to improve convergence, quality, and correlation across implementation stages.
- Partner with EDA vendors and internal CAD teams to evaluate and deploy new signoff capabilities.
- Build dashboards and reporting infrastructure to monitor signoff health and project readiness.
Requirements
Must-have technical skills and experience, plus preferred qualifications.
- Must-have: 8+ years industry experience in Physical Design, Signoff, CAD, or Design Automation.
- Deep expertise in Parasitic Extraction, Static Timing Analysis (STA), Electrical Rule Checking (ERC), and Power Integrity signoff.
- Strong programming and automation skills: Python, Tcl, and shell scripting.
- Experience analyzing and debugging signoff issues and improving signoff convergence.
- Proven ability to collaborate with EDA vendors and cross-functional CAD/design teams.
- Nice-to-have: experience with advanced process nodes (3nm, 2nm, Intel 18A/14A or equivalent), AOCV/POCV and variation-aware timing, power-delivery/EM analysis, machine-learning or agentic AI for CAD, CPU/core or large SoC exposure, and distributed/large-scale signoff infrastructure.
Education Requirements
Required: M.Tech or M.S. in Electrical Engineering, VLSI, Computer Engineering, or a related field.
About the Company
Company: Intel Corporation
Headquarters: Santa Clara, California, USA
Intel Corporation is a leading multinational technology company known for its innovative semiconductor solutions, including microprocessors, artificial intelligence accelerators, and memory products. Headquartered in the United States, Intel focuses on cutting-edge technology and a collaborative working environment, driving advancements in semiconductor manufacturing to meet global demands. The company emphasizes professional development and aims to shape the future of technology through groundbreaking designs.
