Senior ASIC Package Design Automation and AI Engineer

Job Title

Senior ASIC Package Design Automation and AI Engineer

Role Summary

Lead development and deployment of automation and AI-driven workflows for advanced package, interposer, and bridge design to improve efficiency, quality, and scalability of heterogeneous integration technologies.

Work with package design, EDA, simulation, and AI/ML teams to enable automation that supports tape-outs and accelerates advanced packaging innovation.

Experience Level

Senior-level. The posting does not state explicit years of experience.

Responsibilities

Deliver automation and AI-assisted solutions that reduce manual effort, improve design robustness, and integrate with EDA and simulation flows.

• Develop, deploy, and maintain automation frameworks and AI-assisted workflows for substrates, silicon interposers, and bridge-based integration.
• Apply AI/ML methods to auto-routing, placement optimization, signal integrity (SI) and power delivery (PI) improvements, and design-rule compliance.
• Collaborate with package design teams to identify high-impact automation opportunities and shorten cycle time.
• Partner with EDA tool teams and vendors to integrate automation features and enhance tool capabilities.
• Implement data extraction, analysis, and closed-loop optimization with simulation teams.
• Support execution of design milestones and tape-outs, ensuring automation readiness and quality.
• Document best practices and build reusable workflows for team-wide adoption.

Requirements

Must-have technical skills and behaviours for the role; preferred items listed separately.

• Must-have: Practical experience in semiconductor packaging or SoC physical design automation.
• Proficiency in scripting and automation (Python preferred; Tcl, SKILL, or C++ also acceptable).
• Experience applying AI/ML techniques to engineering or design workflows; familiarity with frameworks such as PyTorch or TensorFlow.
• Familiarity with EDA packaging tools (examples: Cadence APD/SiP, Siemens Xpedition, Synopsys 3DICC) or equivalent tools.
• Understanding of design verification flows (DRC/LVS), parasitic extraction, and SI/PI fundamentals.
• Strong problem-solving skills, ownership mindset, and ability to work with limited supervision.
• Experience working with cross-functional teams (Design, SI/PI, Mechanical, EDA).
• Nice-to-have: Experience with closed-loop optimization with simulation teams, tape-out support, and vendor tool integrations.

Education Requirements

Bachelor's or higher degree in Electrical Engineering, Computer Engineering, Computer Science, or a related field.

About the Company

Company: Advanced Micro Devices

Headquarters: Sunnyvale, California, USA

Advanced Micro Devices, or AMD, is a global semiconductor company that designs and manufactures microprocessors, graphics processors, and related technologies for a variety of computing devices. Known for pushing the boundaries of innovation, AMD's mission is to deliver high-performance computing solutions for AI, data centers, gaming, and embedded applications. They foster a collaborative, inclusive culture focused on creativity and problem-solving, aiming to drive progress and excellence in technology.