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Senior Applications and Solutions Engineer - Foundry Services

Intel Corporation
May 06, 2026
Full-time
Remote friendly (Phoenix, Arizona, United States)
Worldwide
$122,440 - $232,190 USD yearly
Physical Design Jobs, Level - Senior

Job Title

Senior Applications and Solutions Engineer - Foundry Services

Role Summary

Provide technical support and execution for ASIC design projects within Intel Foundry Services, focusing on PDKs, digital implementation flows, and multi-voltage-domain power-intent verification. Drive design-kit quality, enable customer tape-outs, and perform complex physical design implementation.

Work with cross-functional teams in the Central Engineering Group to deliver design methods, reference flows, documentation, and customer enablement for advanced process technologies.

Experience Level

Senior β€” position expects experienced engineers. Guidance from the posting: typically 4+ years working with advanced CMOS processes and at least 3+ years in low-power, multi-voltage-domain ASIC implementation and verification.

Responsibilities

Primary responsibilities include customer support, design execution, quality assurance of design kits, and creation of documentation and training materials.

  • Provide technical support to customers on PDKs, digital reference flows, and signoff methodologies for multi-voltage-domain designs.
  • Execute ASIC physical design implementation for complex multi-voltage-domain SoCs, including level-shifters, isolation, power gating, retention, and always-on domains.
  • Implement and verify power intent (UPF/CPF) and perform power-intent verification signoff using tools like VCLP and Conformal LP.
  • Deliver tool/flow/methodology solutions using Cadence and Synopsys tool suites and debug implementation issues.
  • Validate and improve design kits and reference flows; perform reference-flow validation and documentation review.
  • Author application notes, design checklists, and training materials; present technical guidance to customers and internal teams.
  • Collaborate with customers and internal stakeholders to drive successful tape-outs and implementation quality.

Requirements

Key required skills, qualifications, and clearance/citizenship requirements are listed below; preferred items are noted separately.

Must-have

  • US Citizenship required and ability to obtain US government security clearance.
  • 4+ years experience with advanced CMOS processes (16nm and below).
  • 3+ years experience in ASIC implementation and verification focused on low-power, multi-voltage-domain designs.
  • 3+ years experience with scripting (Python, Perl, Tcl, and/or shell).
  • Practical experience with Cadence and Synopsys EDA tool suites for digital/physical design.
  • Deep knowledge and hands-on experience with UPF/CPF implementation and debugging for multi-voltage domains, and experience with power-intent verification tools (VCLP, Conformal LP).
  • Strong communication, collaboration, and customer-facing technical support skills.

Nice-to-have

  • Active US government security clearance (minimum Secret).
  • Experience with state-of-the-art process nodes (7nm and below).
  • Hands-on physical-design implementation and verification methodology experience at block and SoC level for multi-voltage-domain designs.
  • Prior customer-facing technical support or enablement experience.

Education Requirements

Minimum: Bachelor's degree in Electrical Engineering, Computer Engineering, Computer Science, or another STEM field; qualifications may be met via a combination of industry experience, internships, coursework, or research. Preferred: postgraduate degree in a related field. Equivalent practical experience is acceptable where indicated.


About the Company

Company: Intel Corporation

Headquarters: Santa Clara, California, USA

Intel Corporation is a leading multinational technology company known for its innovative semiconductor solutions, including microprocessors, artificial intelligence accelerators, and memory products. Headquartered in the United States, Intel focuses on cutting-edge technology and a collaborative working environment, driving advancements in semiconductor manufacturing to meet global demands. The company emphasizes professional development and aims to shape the future of technology through groundbreaking designs.

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Date Posted: 2026-05-06