Senior Advanced Packaging Technology Development Engineer, Bonding Process

Job Title

Senior Advanced Packaging Technology Development Engineer, Bonding Process

Role Summary

Lead process development and yield improvement for bonding processes used in HBM and WSS. Support advanced packaging technology R&D (chip stacking, 2.5D/3D), coordinate materials and mechanical characterization across global sites, and act as a technical consultant during project execution.

Experience Level

Senior role. The posting specifies a minimum of 2 years of bonding-related experience; the role expects demonstrated experience with advanced bonding technologies and process troubleshooting.

Responsibilities

Primary responsibilities include:

• Drive HBM process development and yield improvements in WSS bonding processes.
• Support advanced packaging R&D (chip stacking, 2.5D/3D) and materials integration efforts.
• Provide on-site technical consultation and support project execution decisions.
• Troubleshoot complex process issues, perform root-cause analysis, and implement corrective actions.
• Prepare technical reports and presentations for internal and external stakeholders.
• Coordinate mechanical and materials characterization efforts across global sites (US, Japan, Singapore).
• Recommend test-structure and test-vehicle designs for material property evaluation.
• Review and present data, lead supplier discussions to align materials with technology roadmaps.
• Integrate AI-assisted tools and identify AI-enabled process or analysis improvements within scope of work.

Requirements

Must-have and preferred qualifications.

• Must-have: Minimum 2 years of bonding-related experience (temporary bonding/debonding, hybrid bonding, or fusion/direct wafer bonding).
• Must-have: Solid understanding of WSS/bond advanced technologies and bonding mechanisms (surface activation, adhesion physics, interface energy, thermo-compression, plasma-assisted bonding).
• Must-have: Strong troubleshooting and root-cause analysis skills for process engineering issues.
• Must-have: Effective collaborator, independent thinker, and strong communication skills in English and Chinese.
• Nice-to-have: Hands-on experience with bonding-related equipment (e.g., SUSS, EVG, TEL).
• Nice-to-have: Experience coordinating global characterization or supplier engagement.
• Nice-to-have: Role-appropriate AI literacy and experience using AI-assisted tools responsibly to improve work outcomes.

Education Requirements

Master's degree or higher preferred (PhD is a plus) in Chemistry, Physics, Materials Science, Engineering Science, or a related technical field.

About the Company

Company: Micron Technology

Headquarters: Boise, Idaho, USA

Micron Technology is a global leader in memory and storage solutions, dedicated to transforming how the world uses information. The company offers a diverse portfolio of high-performance DRAM, NAND, and NOR memory products under the Micron and Crucial brands. With a commitment to customer focus and technological innovation, Micron drives advancements in artificial intelligence, 5G, and other data-centric applications, empowering users to learn, communicate, and progress.