Semiconductor Package Design Engineer

Job Title

Semiconductor Package Design Engineer

Role Summary

Design advanced semiconductor packages (ceramic and organic substrates) including layout, parasitic extraction, and optimization. Work closely with IC, system, SI/PI and thermal teams to develop interposers, substrates, and optimized die/package stack-ups.

Experience Level

Senior-level position — approximately 8–10 years of experience in semiconductor packaging design, modeling, and simulation expected.

Responsibilities

Primary responsibilities include package layout, extraction, analysis, and cross-functional coordination.

• Design package layouts for ceramic and organic substrates using standard CAD tools.
• Collaborate with SoC and IC design teams on die floorplans, bump patterns, and package requirements.
• Develop custom interposer and substrate stack-ups with SI/PI and thermal engineering teams.
• Extract package parasitics and perform power- and signal-integrity analysis and optimization.
• Support 2.5D and 3D package design activities and advanced package technologies.
• Prepare documentation and release designs into the archival system.

Requirements

Must-have technical skills and experience; preferred items noted.

• Proven experience in semiconductor packaging design, modeling, and simulation.
• Strong authority with Cadence Allegro Package Designer Plus (APD+).
• Experience with interposer and substrate layouts and advanced package technologies (2.5D/3D).
• Hands-on experience extracting package parasitics and using SI/PI tools for package-level analysis.
• Experience working with IC design teams on floorplan, bump, and layout optimization for manufacturability and performance.
• Familiarity with Sigrity tools for SI and PI analysis; experience with RF/EM tools (AWR, Momentum, HFSS) is a plus.
• Strong problem solving, written and verbal communication, organization, and ability to work in cross-functional teams.

Education Requirements

Bachelor's degree in Electrical Engineering, Mechanical Engineering, or a related semiconductor packaging discipline is required.

About the Company

Company: Micross

Micross provides microelectronic packaging, engineering, assembly, testing and supply-chain services for advanced semiconductor and electronic components. They support custom package design, interposers, substrates, and related solutions for aerospace, defense and commercial markets.