Semiconductor Package Design Engineer

Job Title

Semiconductor Package Design Engineer

Role Summary

Design and optimize advanced semiconductor packages and interposers (ceramic and organic substrates), perform parasitic extraction and PI/SI analysis, and deliver production-ready package layouts and documentation. Work within cross-functional teams including IC/SoC design, SI/PI, thermal, and system engineering.

Experience Level

Senior level — typically 8 to 10 years of relevant semiconductor packaging design, modeling, and simulation experience.

Responsibilities

Primary responsibilities include package design, analysis, and cross-team coordination:

• Design package layouts for interposers and substrates using standard CAD tools.
• Perform parasitic extraction and run power integrity (PI) and signal integrity (SI) analyses.
• Optimize die floorplan, bump patterns, and interposer/substrate stack-ups with SoC and IC design teams.
• Define IC package requirements in collaboration with IC/system designers.
• Work with SI/PI and thermal engineering teams to address package-level effects on system performance.
• Prepare documentation and release design data into archival/release systems.

Requirements

Key technical skills and experience. Education is summarized separately below.

Must-have:

• 8+ years experience in semiconductor packaging design, modeling, and simulation (experience listed as 8–10 years).
• Proven expertise with Cadence Allegro Package Designer Plus (APD+).
• Experience with interposer and substrate layouts; 2.5D and 3D package design.
• Experience optimizing floorplan, bump patterns, and layout for SoC/package integration.
• Practical experience with package-level parasitic extraction and using SI/PI tools for package/PCB effects.
• Strong problem-solving, written/verbal communication, organization, and ability to work in cross-functional teams.

Nice-to-have:

• Experience with Celsius PowerDC for IR drop and Sigrity Advanced SI/PI toolsets.
• Experience with RF/EM tools such as AWR, Momentum, or HFSS for microwave/RF simulation.

Education Requirements

Bachelor's degree in Electrical Engineering, Mechanical Engineering, or another semiconductor-packaging-related discipline.

About the Company

Company: Micross

Micross provides microelectronic packaging, engineering, assembly, testing and supply-chain services for advanced semiconductor and electronic components. They support custom package design, interposers, substrates, and related solutions for aerospace, defense and commercial markets.