Job Title
Reliability Engineer for BEoL/MoL
Role Summary
Join the BEOL/MoL reliability team to develop, qualify and optimize interconnect reliability for advanced semiconductor metallization schemes. The role works inside an interdisciplinary development and integration organization and interacts with global design, process and integration stakeholders.
Experience Level
Mid-level (Level - Mid-Career). No specific years-of-experience requirement stated.
Responsibilities
Key responsibilities include planning and executing reliability evaluations, analyzing data, and driving design/process decisions based on reliability assessments.
- Develop and execute BEOL/MoL reliability qualifications (EM, IMD-TDDB, SM, TC) for highly integrated metallization and passive devices.
- Analyze reliability test data and lead failure root-cause investigations.
- Define reliability requirements and ensure compliance with customer and internal standards.
- Collaborate with process and integration teams to optimize metallization schemes and materials.
- Assess reliability risks for new processes and design changes and support technology development.
- Drive MRB/PCRB decisions through integrated assessments using metrology, electrical testing and reliability data.
- Maintain reliability-related design rules and models within PDK releases.
- Improve reliability methodologies, models and simulations, including AI-assisted techniques.
- Prepare technical reports and present results to internal stakeholders and customers.
- Support R&D projects and represent results at conferences and workshops.
Requirements
Must-have technical skills and competencies; preferred items listed separately.
- Solid understanding of semiconductor device physics and BEOL integration schemes.
- Experience with reliability mechanisms: Electromigration (EM), TDDB, Stress Migration (SM), and Temperature Cycling (TC).
- Strong statistical data analysis skills and proficiency with tools such as MATLAB, JMP, Minitab, or similar.
- Programming skills (Python, VBA, or similar).
- Familiarity with physical failure analysis techniques.
- Knowledge of reliability simulation and modeling tools.
- Understanding of customer qualification requirements and standards (for example JEDEC).
- Strong problem-solving ability and a structured working approach.
- Excellent English communication skills (C1); German is a plus.
Nice-to-have:
- Experience in semiconductor manufacturing or a foundry environment.
- Experience with advanced technology nodes (<90 nm) and applications such as embedded NVM, RF, analog/mixed-signal, HV/BCD.
- Hands-on experience with EDA-based EM/IR analysis and sign-off methodologies, including mission profile analysis.
Education Requirements
Master's, Diploma or PhD in Electrical Engineering, Physics, Materials Science, or a related field.
About the Company
Company: GlobalFoundries
Headquarters: Saratoga Springs, New York, USA
GlobalFoundries is a leading contract manufacturer for the global semiconductor industry, with facilities in multiple countries, including the USA. The company develops a broad portfolio of semiconductor technologies and employs around 13,000 people worldwide. GlobalFoundries focuses on enhancing competitiveness in specialized application solutions and fostering innovation in mobile communications, consumer electronics, and automotive applications.

Date Posted: 2026-06-03