R&D Physical Design Engineer

Job Title

R&D Physical Design Engineer

Role Summary

Work on physical implementation of ASIC designs: floorplanning, placement, timing closure, signoff checks, and verification-related flows. The role is part of an R&D physical design team based in Shanghai focused on advanced-node chip implementation and tapeout.

Experience Level

Senior — candidates with 7+ years of relevant ASIC/VLSI experience preferred.

Responsibilities

Deliver block- and top-level physical implementation and participate in full-chip signoff activities.

• Perform floorplanning, placement, and layout optimization for blocks and top-level integration.
• Drive design closure and static timing analysis (STA) to meet timing and power targets.
• Run and interpret DRC/LVS checks and support design verification signoff.
• Execute full-chip signoff tasks including power integrity (PI), signal integrity (SI), process verification (PV) and STA.
• Independently handle block implementation and top-level integration tasks.
• Automate flows and scripts using Perl/Tcl; debug implementation issues and collaborate across teams.

Requirements

Must-have technical skills and experience are listed first; additional skills that are beneficial follow.

• Must-have: Solid VLSI background and clear understanding of the ASIC design flow.
• Proven ability to perform block and top-level physical implementation independently.
• Tapeout experience on advanced nodes (7nm and below).
• Proficiency with static timing analysis (STA), timing closure methodologies, and DRC/LVS workflows.
• Proficient in Perl and Tcl for flow automation and debug.
• Strong communication and problem-solving skills.
• Nice-to-have: Experience with DFT insertion and power/IVD analysis.

Education Requirements

Preferred: MS with 7+ years experience or BS with 8+ years experience. Major in Microelectronics or a related discipline. (No specific certifications listed.)

About the Company

Company: Broadcom

Headquarters: Irvine, California, United States

Broadcom is a global technology leader that designs, develops, and supplies a wide range of semiconductor and infrastructure software solutions. The company is known for its innovations in wireless and broadband communications, enabling a connected world.