R&D Engineering Director
SynopsysJob Title
R&D Engineering Director
Role Summary
Lead R&D strategy and execution for Synopsys semiconductor packaging solutions, covering package design, signal and power integrity analysis, and 3DIC integration. The role owns the product roadmap, drives customer technical engagements, and builds a team of packaging engineers to deliver production-ready solutions.
Experience Level
Senior — requires extensive industry experience; posting specifies 15+ years in semiconductor packaging engineering.
Responsibilities
Primary responsibilities include technical leadership, roadmap ownership, customer engagement, and team development.
- Define and execute R&D strategy for IC package design, SIPI analysis, and 3DIC methodologies.
- Drive technical engagements with customers on advanced packaging challenges (PCIe, DDR5, HBM3/HBM4/HBM4E).
- Own product requirements and roadmap for packaging design and analysis capabilities.
- Build, mentor, and grow a team of packaging engineers; establish best practices across design, simulation, and manufacturing workflows.
- Work hands-on with layout, design, and SIPI analysis tools to validate approaches and resolve escalations.
- Represent the company in technical forums, customer design reviews, and industry consortia.
- Partner with sales and field teams to shape customer solutions and close technical gaps.
Requirements
Must-have technical experience and leadership skills required for the role; list highlights core qualifications.
- Must-have: 15+ years of hands-on semiconductor packaging experience across design, analysis, and manufacturing.
- Must-have: Deep expertise across the full packaging flow from die attach and interconnect to package assembly and board integration.
- Must-have: Proven experience with high-speed interface design and analysis (PCIe, DDR5, HBM3, HBM4, HBM4E).
- Must-have: Working knowledge of industry-standard package layout, design, and signal/power integrity analysis tools.
- Must-have: Demonstrated ability to lead and grow engineering teams and to engage directly with customers on technical solutions.
- Nice-to-have: Experience with 3DIC design methodologies (die stack through package and PCB integration).
Education Requirements
Not specified.
About the Company
Company: Synopsys
Headquarters: Mountain View, California, USA
Synopsys is a leading company in electronic design automation (EDA) and semiconductor IP solutions. It provides tools and services for designing and verifying complex semiconductor devices and systems. The company plays a pivotal role in the semiconductor industry, helping engineers innovate and deliver higher-quality products faster. Synopsys is committed to advancing technology standards and offers a range of software and hardware solutions to its clients globally.
