R&D Engineer

Job Title

R&D Engineer

Role Summary

Technical lead for advanced semiconductor packaging and multi‑chip module integration, focused on developing manufacturable, reliable assembly technologies for artificial intelligence and high‑performance computing products.

The role partners with internal IC design/validation teams and external foundry and OSAT collaborators to define technology roadmaps, drive process R&D through product introduction, and provide hands‑on support for qualification and problem resolution.

Experience Level

Senior — requires extensive industry experience (guidance: roughly 12–15+ years of relevant semiconductor process, packaging, or manufacturing experience).

Responsibilities

Primary responsibilities include leading development and qualification of advanced packaging and multi‑chip assembly technologies and managing projects from concept to high‑volume manufacturing.

• Lead technology and system pathfinding for multi‑chip assemblies targeting AI and HPC modules.
• Own and execute portions of the advanced packaging and assembly technology roadmap from R&D through new product introduction.
• Define technology requirements, evaluation and qualification plans, and transition plans for productization.
• Provide hands‑on applications support and problem solving during process development and product integration.
• Serve as principal investigator for new technology projects and manage cross‑functional collaboration with foundries, OSATs, design, and validation teams.
• Perform risk assessments and coordinate technology risk mitigation across multiple concurrent projects.

Requirements

Must‑have technical skills and experience required for success in this role.

• Broad knowledge of advanced packaging, assembly and silicon process technologies, including thermal solutions and power delivery systems.
• Experience with electrical and optical interconnects and with serial and parallel interface design for chip‑to‑chip and module communications.
• Proven experience with parametric and yield data analysis and statistical tools.
• Experience identifying yield failure mechanisms and using root‑cause tools (EFA, PFA).
• Experience with thermal and stress simulation tools.
• Strong data analysis, problem solving, project management, and interpersonal communication skills.
• Demonstrated ability to collaborate with external foundry R&D and OSAT partners and to transfer technologies to high‑volume manufacturing.
• Hands‑on approach to technology qualification and product enablement.

Education Requirements

Required: Master of Science in Electrical Engineering (MSEE) plus 15+ years of relevant semiconductor process/advanced packaging R&D and manufacturing experience, or PhD in Electrical Engineering (or related field) plus 12+ years of relevant experience.

About the Company

Company: Broadcom

Headquarters: Irvine, California, United States

Broadcom is a global technology leader that designs, develops, and supplies a wide range of semiconductor and infrastructure software solutions. The company is known for its innovations in wireless and broadband communications, enabling a connected world.