Job Title
Principal Test and Characterization Engineer — Quantum
Role Summary
Lead electrical test and characterization activities for semiconductor and quantum devices within the Quantum Technology Solutions organization. The role focuses on defining and executing measurement methodologies, automating test flows, and providing data-driven analysis to support device validation, reliability assessment, and process optimization.
Work emphasizes hands-on lab execution (including cryogenic testing), test automation, and statistical analysis to enable scalable, reliable device platforms.
Experience Level
Senior — principal-level engineer. Typical experience: 5–8+ years in semiconductor device characterization, test engineering, or equivalent technical experience.
Responsibilities
Primary responsibilities include hands-on test development, measurement execution, and data analysis to support device performance and reliability.
- Develop and execute electrical characterization methodologies (DC, RF, pulsed, transient) for semiconductor and quantum devices.
- Design and implement test plans to evaluate device performance, variability, and parametric behavior across operating conditions.
- Perform reliability testing and stress measurements (TDDB, BTI, HCI, electromigration) and analyze failure mechanisms.
- Develop and maintain automated test programs and scripts for probe and bench-top measurement systems.
- Operate wafer probe stations, parameter analyzers, RF test systems, and cryogenic test platforms.
- Support characterization at cryogenic temperatures and low-noise quantum-sensitive measurement environments.
- Analyze electrical and reliability data to identify trends, variability sources, and correlations with process/materials.
- Support development of test structures (PCMs, test macros, test chips) and model extraction.
- Apply statistical analysis and variability modeling (DOE) to support process optimization and yield improvement.
- Document test methodologies, results, and analysis for knowledge transfer and scalable development.
- Perform all work in compliance with Environmental, Health, Safety & Security requirements.
Requirements
Must-have technical skills and experience; preferred items follow.
- 5–8+ years in semiconductor device characterization, test engineering, or related field (hands-on lab and measurement experience).
- Experience with electrical characterization techniques and measurement systems (parameter analyzers, probe stations, RF test systems).
- Experience with reliability testing and failure analysis methodologies.
- Experience writing test automation code (Python, LabVIEW, MATLAB, or similar).
- Strong understanding of semiconductor device physics and device operation.
- Experience analyzing large datasets and extracting actionable performance insights.
- Strong analytical, problem-solving, and communication skills.
Nice-to-have:
- RF or high-frequency device characterization experience.
- Cryogenic testing or low-temperature device measurement experience.
- Familiarity with quantum devices (superconducting, topological, etc.).
- Wafer-level test, probe card development, or test hardware integration experience.
- Experience with statistical analysis, variability modeling, and DOE methodologies.
- Experience correlating electrical data with process or materials changes; prior advanced R&D environment experience.
Education Requirements
Bachelor's or Master's degree in Electrical Engineering, Physics, Materials Science, or a related technical field (BS or MS). The posting specifies these degrees; equivalent practical experience is commonly considered.
About the Company
Company: GlobalFoundries
Headquarters: Saratoga Springs, New York, USA
GlobalFoundries is a leading contract manufacturer for the global semiconductor industry, with facilities in multiple countries, including the USA. The company develops a broad portfolio of semiconductor technologies and employs around 13,000 people worldwide. GlobalFoundries focuses on enhancing competitiveness in specialized application solutions and fostering innovation in mobile communications, consumer electronics, and automotive applications.

Date Posted: 2026-08-14