Quantum Superconducting Materials Engineer

Job Title

Quantum Superconducting Materials Engineer

Role Summary

R&D materials engineer responsible for developing, selecting, and integrating cryogenic and superconducting materials for scalable quantum packaging. The role sits on the Quantum Advanced Packaging team and owns materials solutions from concept through prototyping and manufacturing.

Experience Level

Senior-level. The posting expects a senior engineer with substantial prior related experience (see Education Requirements for specified experience guidance).

Responsibilities

Main technical and integration responsibilities include:

• Lead selection and development of superconducting metals and cryogenic-compatible interconnects and dielectrics (e.g., Nb, Al, NbN; In, Cu, Sn-based systems).
• Define material stacks and interfaces across BEOL/RDL layers, interposers/TSVs, and bump/bonding interfaces for 2D, 2.5D, and 3D packaging.
• Develop and qualify processes for deposition, plating, bonding, and surface preparation; ensure compatibility with fab and downstream assembly.
• Establish and execute characterization methods (electrical, thermal, structural) and correlate material behavior to device- and system-level performance.
• Analyze failure mechanisms (delamination, intermetallic formation, stress-induced cracking) and implement mitigations to improve reliability under cryogenic cycling.
• Drive process optimization, control plans, and transfer of prototypes across fab and assembly workflows.
• Collaborate with device, qubit, interconnect, and system engineering teams to co-optimize materials, processes, and architectures.
• Work with suppliers, equipment vendors and OSAT partners to evaluate, specify, and qualify new materials; lead technical external engagements.
• Contribute to roadmap development, IP generation, publications, and mentor junior engineers.

Requirements

Must-have technical qualifications and behaviors; preferred items listed separately.

• Deep technical expertise with cryogenic and superconducting material properties (electrical, thermal, mechanical) and reliability considerations.
• Proven experience integrating materials into advanced packaging flows (BEOL/RDL, interposers, TSVs, bump/bonding).
• Hands-on process development experience for deposition, plating, bonding and surface preparation and ability to drive process integration into manufacturing.
• Ability to design and execute electrical, thermal and structural characterization and correlate results to system performance.
• Proven experience engaging and managing supplier/equipment vendor evaluations and material qualifications.
• English fluency (written and verbal) and effective stakeholder communication skills.
• Willingness to travel up to 20%.

Nice-to-have:

• Demonstrated leadership and project management experience in R&D or manufacturing settings.
• Experience contributing to packaging roadmaps and cross-functional integration strategies.
• Strong planning, organizational and presentation skills.

Education Requirements

Required: Master’s degree (MS) in Electrical Engineering, Mechanical Engineering, Chemical Engineering, Materials Science or a related field from an accredited program; the posting specifies an MS plus at least 15 years of related work experience and a minimum overall GPA of 3.0. Preferred: PhD (posting notes PhD preferred with ~12 years of related experience).

About the Company

Company: GlobalFoundries

Headquarters: Saratoga Springs, New York, USA

GlobalFoundries is a leading contract manufacturer for the global semiconductor industry, with facilities in multiple countries, including the USA. The company develops a broad portfolio of semiconductor technologies and employs around 13,000 people worldwide. GlobalFoundries focuses on enhancing competitiveness in specialized application solutions and fostering innovation in mobile communications, consumer electronics, and automotive applications.