Quantum NCG 3DHI Engineer

Job Title

Quantum NCG 3DHI Engineer

Role Summary

R&D bonding integration engineer on the Quantum Advanced Packaging team focused on wafer-to-wafer and die-to-wafer 3D heterogeneous integration (3DHI) development.

The role partners with internal process teams, suppliers and OSATs to develop integration schemes, improve yields, shorten cycle time, and generate IP for wafer integration and packaging technology.

Experience Level

Entry-level / New college graduate. Prior internship or co-op experience expected.

Responsibilities

Primary responsibilities include process development, characterization, failure analysis, and cross-functional collaboration for 3DHI and advanced packaging.

• Plan and drive 3DHI process development with unit process engineers and suppliers.
• Collaborate with OSATs to develop wafer-level and die-level 2.5D and 3D integration processes.
• Develop expertise in processes, materials and tooling using characterization resources.
• Investigate failure modes and establish mechanistic understanding to improve yields.
• Design integration schemes to reduce cycle time and cost.
• Generate intellectual property related to wafer integration and packaging technologies.
• Coordinate with other teams on assignments and perform duties as assigned.
• Comply with Environmental, Health, Safety & Security requirements.

Requirements

Must-have qualifications and practical expectations for the role.

• Prior related internship or co-op experience in semiconductor or packaging development.
• Fluent in English (written and verbal).
• Willingness to travel up to 10%.
• Ability to work effectively with suppliers, OSAT partners and cross-functional teams.
• Ability to plan and execute experiments, analyze results and document findings.
• Nice-to-have: knowledge of semiconductor packaging process modules and integration, leadership or project management experience, strong planning and organizational skills.

Education Requirements

Bachelor's or Master's degree in Electrical Engineering, Mechanical Engineering, Chemical Engineering, Materials Science, or a related technical field from an accredited program. PhD level is preferred. The posting also specifies a minimum overall GPA of 3.0 and prior internship/co-op experience.

About the Company

Company: GlobalFoundries

Headquarters: Saratoga Springs, New York, USA

GlobalFoundries is a leading contract manufacturer for the global semiconductor industry, with facilities in multiple countries, including the USA. The company develops a broad portfolio of semiconductor technologies and employs around 13,000 people worldwide. GlobalFoundries focuses on enhancing competitiveness in specialized application solutions and fostering innovation in mobile communications, consumer electronics, and automotive applications.