Quantum Assembly Engineer

Job Title

Quantum Assembly Engineer

Role Summary

R&D assembly engineer on the Quantum Advanced Packaging team responsible for developing and integrating cryogenic, superconducting assembly processes to enable scalable quantum hardware packaging. The role works within GlobalFoundries Fab9 Advanced Packaging and Photonics Center (APPC) and with external partners and OSATs.

Experience Level

Senior-level; posting specifies experienced candidates (approximately 8–10+ years of related experience, with the posting indicating ~10+ years for the required degree level).

Responsibilities

Drive development, integration, and scaling of cryogenic-compatible assembly processes and ensure assembled hardware meets mechanical and electrical requirements at cryogenic temperatures.

• Lead development of cryogenic-compatible assembly processes for 2D, 2.5D, and 3D quantum packaging platforms.
• Define assembly schemes for flip-chip, micro-bump, superconducting bump attach, die-to-wafer, wafer-to-wafer, and hybrid bonding.
• Own assembly integration flows from incoming wafer/die through package build and maintain process flow specifications and travelers.
• Coordinate cross-functional interactions (bump/interconnect, TSV/interposer integration, substrate/package assembly).
• Enable and support prototype builds; perform hands-on build/debug during early development phases.
• Drive assembly readiness for new technologies including tooling, materials, and process modules; define equipment requirements for precision alignment and cryogenic handling.
• Lead failure analysis and root-cause investigations for alignment, voiding, delamination, and interconnect failures.
• Work with test and systems teams to ensure cryogenic reliability across thermal cycles and electrical/RF/microwave integrity.
• Interface with OSATs, assembly partners, and suppliers to co-develop and scale assembly processes.
• Contribute to APPC/Quantum packaging roadmap, generate technical updates, data analysis, reports, and support IP/publication efforts.

Requirements

Core technical skills and experience expected (degree details are summarized in Education Requirements below).

• In-depth knowledge of BEOL processes and integration, bump/wafer finish integration, wafer test/probe, OSAT collaboration, and package development & assembly.
• Proven experience defining assembly integration flows and process specifications for advanced packaging.
• Strong problem-solving and technical troubleshooting skills, including expertise in design of experiments (DOE).
• Hands-on experience with prototype builds, debug, and failure analysis in assembly environments.
• Experience with cryogenic reliability testing, thermal cycling, and electrical/RF integrity requirements.
• Ability to evaluate and select assembly materials and interfaces (e.g., indium, superconducting metals, underfills, substrates) for cryogenic operation.
• Familiarity with precision alignment/bonding tools and materials handling for cryogenic-compatible processes.
• Strong written and verbal communication skills and ability to produce clear technical reports and updates.
• English fluency (written and verbal) and willingness to travel up to 10%.

Education Requirements

Posting specifies a Master's degree in Electrical Engineering, Mechanical Engineering, Chemical Engineering, Materials Science, or a related field from an accredited program; the MS-level requirement is listed with at least 10 years of prior related work experience. A PhD is preferred (with at least ~8 years of related experience). The posting also requires a minimum overall GPA of 3.0. Fields of study include electrical, mechanical, chemical engineering, materials science, or related technical fields.

About the Company

Company: GlobalFoundries

Headquarters: Saratoga Springs, New York, USA

GlobalFoundries is a leading contract manufacturer for the global semiconductor industry, with facilities in multiple countries, including the USA. The company develops a broad portfolio of semiconductor technologies and employs around 13,000 people worldwide. GlobalFoundries focuses on enhancing competitiveness in specialized application solutions and fostering innovation in mobile communications, consumer electronics, and automotive applications.