Quantum Advanced Packaging Manager

Job Title

Quantum Advanced Packaging Manager

Role Summary

Manage the Quantum advanced packaging team at Fab9 (Burlington, VT) to develop cryogenic and superconducting packaging capabilities including wafer-to-wafer (W2W) hybrid/fusion bonding, die-to-wafer (D2W) hybrid bonding, and interposers. Lead program planning, technical execution, vendor partnerships and prototype development to deliver on roadmap objectives.

Experience Level

Senior — requires 10+ years of related technical experience and at least 2 years of technical lead experience; travel up to 10%.

Responsibilities

Accountable for team leadership, program delivery, and cross-functional coordination to implement advanced packaging development.

• Lead, coach, and develop the Quantum Advanced Packaging team; manage hiring and onboarding.
• Plan and oversee project execution to meet timelines, quality, and technical objectives.
• Define and scope development programs aligned with internal and external customer needs.
• Manage budgets and resource allocation for prototype and development work.
• Establish and maintain partnerships with vendors and development collaborators.
• Coordinate cross-functional teams and provide regular status updates to stakeholders and senior management.
• Resolve conflicts, address employee concerns, and perform performance management.
• Ensure compliance with Environmental, Health, Safety & Security requirements.

Requirements

Core technical and leadership requirements for the role.

• 10+ years of prior related work experience in semiconductor packaging or closely related fields.
• Minimum 2 years of technical lead experience; experience supervising or mentoring engineers.
• Proven experience with advanced packaging processes; experience with W2W and D2W hybrid/fusion bonding and interposers is important; experience with cryogenic/superconducting packaging is a strong plus.
• Program and project management skills, including planning, reviews, and stakeholder communication.
• Experience managing budgets and allocating resources for prototype and development programs.
• Strong written and verbal communication skills and ability to work effectively across functions.
• Willingness to work on-site at Fab9 (Burlington, VT) and travel up to 10%.
• Nice-to-have: 12+ years technical experience, 3+ years of people management experience, strong planning and organizational skills, and demonstrated ability to navigate ambiguity.

Education Requirements

Required: Masters degree in Electrical Engineering, Mechanical Engineering, Chemical Engineering, Materials Science, or a related field from an accredited program. Preferred: PhD in one of these fields. (Education credentials were specified by the employer.)

About the Company

Company: GlobalFoundries

Headquarters: Saratoga Springs, New York, USA

GlobalFoundries is a leading contract manufacturer for the global semiconductor industry, with facilities in multiple countries, including the USA. The company develops a broad portfolio of semiconductor technologies and employs around 13,000 people worldwide. GlobalFoundries focuses on enhancing competitiveness in specialized application solutions and fostering innovation in mobile communications, consumer electronics, and automotive applications.