Job Title
Product Physical Failure Analysis Engineer
Role Summary
Lead root-cause physical failure analysis for semiconductor devices to improve yield, reliability, and customer returns. Work with product, yield, and process teams to identify failure modes, develop corrective actions, and transfer new products to manufacturing.
Experience Level
Senior-level. The role requires extensive industry experience; minimum guidance: 8+ years in semiconductor failure analysis.
Responsibilities
Key responsibilities include fault isolation, failure analysis execution, and communicating findings to engineering teams.
- Collaborate with product, yield, and reliability engineers to support fault isolation during development and yield/reliability assessments.
- Perform physical failure analysis and determine root cause for device failures.
- Interpret emission microscope, laser voltage probing, and OBIRCH data for fault localization.
- Define and execute analyses using SEM, FIB (layer-by-layer deprocessing), and EDX.
- Use layout, schematic, and design analysis tools to relate physical defects to circuit behavior.
- Develop failure mode and effects analyses (FMEA) and maintain control plans through product lifecycle.
- Prepare technical reports and present findings and corrective actions to stakeholders.
- Drive automation and process improvements for failure analysis workflows and evaluate new analytical tools.
Requirements
Must-have technical skills, tools, and experience.
- 8+ years of experience in semiconductor failure analysis and driving investigations to root cause, yield, and reliability improvements.
- 8+ years using layout and design tools (e.g., Virtuoso, Avalon, SysNav).
- 8+ years implementing failure analysis techniques: die milling/thinning, Focused Ion Beam (FIB) milling, Scanning Electron Microscopy (SEM), and Energy Dispersive X-ray Spectroscopy (EDX).
- Experience with fault isolation techniques and test data interpretation (emission, laser probing, OBIRCH).
- Ability to develop and maintain FMEA/control plans and produce clear technical reports.
- Experience applying failure analysis to package-level issues is beneficial.
- Preferred: familiarity with FPGA architecture, design-for-test/debug features, and Teradyne Ultraflex tester.
- Must be eligible for required U.S. export authorizations.
Education Requirements
Bachelor of Science (BS) in Electrical Engineering, Materials Science, Physics, Mechanical Engineering, or a related field is required.
About the Company
Company: Altera
Headquarters: Bengaluru, Karnataka, India
Altera provides leadership programmable solutions for applications ranging from cloud to edge, unveiling limitless AI possibilities. Their extensive product portfolio includes FPGAs, CPLDs, Intellectual Property, development tools, and System on Modules aimed at accelerating innovation in various fields.

Date Posted: 2026-08-22